Intel vs Marvell
Intel and Marvell are both placed on 3 of the same AI data center parts in this catalog, spanning layers 1, 3. Intel appears on 9 parts in total and Marvell on 13.
At a glance
| Intel | Marvell | |
|---|---|---|
| Ownership | public | public |
| Headquarters | Santa Clara, United States | Santa Clara, United States |
| Primary listing | INTC | MRVL |
| Market cap | 459.7B USD | 205.4B USD |
| Parts placed | 9 | 13 |
| Layers covered | 2 | 3 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 5 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- NICs / SuperNICs — Network interface cards, including Nvidia's higher-bandwidth "SuperNIC" variants, that connect a server's CPU and GPUs to the cluster network.
- DPUs — Data Processing Units that offload networking, storage, and security functions from the host CPU onto a dedicated, programmable chip.
- Silicon photonics & co-packaged optics — An approach that integrates optical components directly onto or next to the switch or GPU package, replacing some pluggable transceivers with light routed closer to the silicon.
The 3 parts both make
| Part | Intel | Marvell |
|---|---|---|
| NICs / SuperNICs Layer 1 — Compute silicon & packaging | manufacturer inferred | manufacturer inferred |
| DPUs Layer 1 — Compute silicon & packaging | manufacturer inferred IPU | manufacturer inferred OCTEON |
| Silicon photonics & co-packaged optics Layer 3 — Networking & interconnect | manufacturer inferred | manufacturer inferred |
Only Intel
- Merchant GPUs / accelerators layer 1
- Server CPUs layer 1
- Leading-edge foundry layer 1
- 2.5D/3D advanced packaging layer 1
- Glass-core substrates layer 1
- Interposers, silicon bridges, RDL layer 1
Only Marvell
- Hyperscaler custom ASICs layer 1
- ASIC design services, IP & EDA layer 1
- CXL controllers & memory expanders layer 2
- PCIe/CXL switches & retimers layer 2
- Scale-out switch ASICs layer 3
- Optical DSPs, drivers, TIAs layer 3
- DCI / coherent optics layer 3
- Timing & telemetry silicon layer 3
- Controllers layer 2
- Retimers inside AECs layer 3
Questions
- Do Intel and Marvell compete?
- In this catalog they are both placed on 3 of the same parts, across 2 layers: NICs / SuperNICs, DPUs, Silicon photonics & co-packaged optics. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Intel or Marvell?
- Intel has 9 placements and Marvell has 13. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.