Delta Electronics vs Foxconn
Delta Electronics and Foxconn are both placed on 5 of the same AI data center parts in this catalog, spanning layers 4, 5. Delta Electronics appears on 18 parts in total and Foxconn on 9.
At a glance
| Delta Electronics | Foxconn | |
|---|---|---|
| Ownership | public | public |
| Headquarters | Taipei, Taiwan | New Taipei City, Taiwan |
| Primary listing | 2308.TW | 2317.TW |
| Market cap | 4.05T TWD | 3.45T TWD |
| Parts placed | 18 | 9 |
| Layers covered | 6 | 2 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Fans — The axial and centrifugal fans mounted in server chassis and rack trays that move air across heatsinks and boards, still needed even in racks that use liquid cooling for the highest-power chips.
- Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
- Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
- 1 more in the table below.
The 5 parts both make
| Part | Delta Electronics | Foxconn |
|---|---|---|
| Fans Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Air-cooled heatsinks & vapor chambers Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | in house inferred |
| Rack manifolds Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
| Coolant distribution units Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
Only Delta Electronics
- Switch systems & white-box ODMs layer 3
- Board-level power: VRMs, power stages, PoL, power semis layer 4
- Power shelves & PSUs layer 4
- In-rack busbar & power whips layer 4
- Rack PDUs layer 4
- Building management, controls, environmental sensors layer 6
- Busway / busbar trunking layer 7
- Floor PDUs, RPPs, static transfer switches, ATS layer 7
- UPS (static, modular, rotary/DRUPS) & UPS power semis layer 7
- Power smoothing / supercapacitors layer 7
- and 3 more on Delta Electronics's page.
Only Foxconn
- Rack-scale systems layer 4
- EMS, system integration & rack-level test layer 4
- GPU baseboards & compute trays layer 4
- Chassis, rails, rack enclosures layer 4
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Delta Electronics and Foxconn compete?
- In this catalog they are both placed on 5 of the same parts, across 2 layers: Fans, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds and 1 more. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Delta Electronics or Foxconn?
- Delta Electronics has 18 placements and Foxconn has 9. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.