Foxconn vs Vertiv
Foxconn and Vertiv are both placed on 3 of the same AI data center parts in this catalog, spanning layer 5. Foxconn appears on 9 parts in total and Vertiv on 22.
At a glance
| Foxconn | Vertiv | |
|---|---|---|
| Ownership | public | public |
| Headquarters | New Taipei City, Taiwan | Westerville, United States |
| Primary listing | 2317.TW | VRT |
| Market cap | 3.45T TWD | 74.8B USD |
| Parts placed | 9 | 22 |
| Layers covered | 2 | 6 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 2 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
- Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
- Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.
The 3 parts both make
| Part | Foxconn | Vertiv |
|---|---|---|
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | in house inferred | manufacturer inferred |
| Rack manifolds Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
| Coolant distribution units Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
Only Foxconn
- Rack-scale systems layer 4
- EMS, system integration & rack-level test layer 4
- GPU baseboards & compute trays layer 4
- Fans layer 4
- Chassis, rails, rack enclosures layer 4
- Air-cooled heatsinks & vapor chambers layer 4
Only Vertiv
- Power shelves & PSUs layer 4
- Rack PDUs layer 4
- Rear-door heat exchangers layer 5
- Leak detection, flow & pressure sensing layer 5
- Rack/row cooling controls & software layer 5
- Chillers & compressors layer 6
- Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors layer 6
- CRAH / CRAC / fan walls / in-row units layer 6
- Building management, controls, environmental sensors layer 6
- MV switchgear, E-houses, power skids layer 7
- and 9 more on Vertiv's page.
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Foxconn and Vertiv compete?
- In this catalog they are both placed on 3 of the same parts, across 1 layer: Direct-to-chip cold plates, Rack manifolds, Coolant distribution units. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Foxconn or Vertiv?
- Foxconn has 9 placements and Vertiv has 22. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.