Boyd vs Delta Electronics
Boyd and Delta Electronics are both placed on 4 of the same AI data center parts in this catalog, spanning layers 4, 5. Boyd appears on 5 parts in total and Delta Electronics on 18.
At a glance
| Boyd | Delta Electronics | |
|---|---|---|
| Ownership | private | public |
| Headquarters | United States | Taipei, Taiwan |
| Primary listing | none in catalog | 2308.TW |
| Market cap | 4.05T TWD | |
| Parts placed | 5 | 18 |
| Layers covered | 3 | 6 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
- Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
- Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.
The 4 parts both make
| Part | Boyd | Delta Electronics |
|---|---|---|
| Air-cooled heatsinks & vapor chambers Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer disclosed | manufacturer inferred |
| Rack manifolds Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer disclosed | manufacturer inferred |
| Coolant distribution units Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
Only Boyd
Only Delta Electronics
- Switch systems & white-box ODMs layer 3
- Board-level power: VRMs, power stages, PoL, power semis layer 4
- Power shelves & PSUs layer 4
- Fans layer 4
- In-rack busbar & power whips layer 4
- Rack PDUs layer 4
- Building management, controls, environmental sensors layer 6
- Busway / busbar trunking layer 7
- Floor PDUs, RPPs, static transfer switches, ATS layer 7
- UPS (static, modular, rotary/DRUPS) & UPS power semis layer 7
- and 4 more on Delta Electronics's page.
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Boyd and Delta Electronics compete?
- In this catalog they are both placed on 4 of the same parts, across 2 layers: Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds, Coolant distribution units. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Boyd or Delta Electronics?
- Boyd has 5 placements and Delta Electronics has 18. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.