Intel vs Samsung Electronics
Intel and Samsung Electronics are both placed on 3 of the same AI data center parts in this catalog, spanning layer 1. Intel appears on 9 parts in total and Samsung Electronics on 10. 2 of the shared parts are supply-constrained.
At a glance
| Intel | Samsung Electronics | |
|---|---|---|
| Ownership | public | public |
| Headquarters | Santa Clara, United States | Suwon, South Korea |
| Primary listing | INTC | 005930.KS |
| Market cap | 459.7B USD | 1403.32T KRW |
| Parts placed | 9 | 10 |
| Layers covered | 2 | 2 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 5 | 6 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Leading-edge foundry — The advanced-node semiconductor fabs that manufacture the compute dies for essentially every AI accelerator on the market.
- 2.5D/3D advanced packaging — The 2.5D/3D processes that combine a compute die, HBM memory stacks, and a substrate into one finished package — the step that turns silicon into a shippable AI accelerator.
- Interposers, silicon bridges, RDL — The silicon interposers, bridges, and redistribution layers that route signals between a compute die, HBM stacks, and the substrate inside an advanced package.
The 3 parts both make
| Part | Intel | Samsung Electronics |
|---|---|---|
| Leading-edge foundryconstrained Layer 1 — Compute silicon & packaging | manufacturer inferred Foundry | manufacturer disclosed Foundry |
| 2.5D/3D advanced packagingconstrained Layer 1 — Compute silicon & packaging | manufacturer inferred Foundry | manufacturer inferred |
| Interposers, silicon bridges, RDL Layer 1 — Compute silicon & packaging | manufacturer inferred | manufacturer inferred |
Only Intel
- Merchant GPUs / accelerators layer 1
- Server CPUs layer 1
- NICs / SuperNICs layer 1
- DPUs layer 1
- Glass-core substrates layer 1
- Silicon photonics & co-packaged optics layer 3
Only Samsung Electronics
- HBM layer 2
- DRAM layer 2
- Memory modules layer 2
- CXL controllers & memory expanders layer 2
- NAND flash layer 2
- Drives layer 2
- Controllers layer 2
Named in the same machines
- Aurora supercomputer
Questions
- Do Intel and Samsung Electronics compete?
- In this catalog they are both placed on 3 of the same parts, across 1 layer: Leading-edge foundry, 2.5D/3D advanced packaging, Interposers, silicon bridges, RDL. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Intel or Samsung Electronics?
- Intel has 9 placements and Samsung Electronics has 10. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
- Which shared parts are supply-constrained?
- Leading-edge foundry, 2.5D/3D advanced packaging. These carry a sourced constraint tag on the parts page.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.