Samsung Electronics vs SK Hynix
Samsung Electronics and SK Hynix are both placed on 6 of the same AI data center parts in this catalog, spanning layer 2. Samsung Electronics appears on 10 parts in total and SK Hynix on 6. 2 of the shared parts are supply-constrained.
At a glance
| Samsung Electronics | SK Hynix | |
|---|---|---|
| Ownership | public | public |
| Headquarters | Suwon, South Korea | Icheon, South Korea |
| Primary listing | 005930.KS | 000660.KS |
| Market cap | 1403.32T KRW | 930.76T KRW |
| Parts placed | 10 | 6 |
| Layers covered | 2 | 1 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 6 | 6 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- HBM — High-bandwidth memory stacked directly on the same package as an AI accelerator, giving the GPU or ASIC very fast, close-range access to the memory it needs to stay fed.
- DRAM — Off-package system memory — DDR5 modules for host CPUs and LPDDR5X soldered near Nvidia's Grace CPU — that holds the working data a server's processors operate on.
- Memory modules — The physical DIMM (or module) that packages raw DRAM die, substrate, and management circuitry into the pluggable unit a server actually sockets.
- CXL controllers & memory expanders — Chips that let a server attach an extra pool of DRAM over a CXL link rather than only through the CPU's own memory channels, expanding usable capacity beyond what fits in local DIMM slots.
- 2 more in the table below.
The 6 parts both make
| Part | Samsung Electronics | SK Hynix |
|---|---|---|
| HBMconstrained Layer 2 — Memory & storage | manufacturer disclosed | manufacturer disclosed 62% of HBM revenue in Q2 2025, per Chosun Biz via Astute Group, 2025-09-24 -- a single-quarter figure, not a running average |
| DRAMconstrained Layer 2 — Memory & storage | manufacturer disclosed | manufacturer disclosed |
| Memory modules Layer 2 — Memory & storage | manufacturer disclosed | manufacturer disclosed |
| CXL controllers & memory expanders Layer 2 — Memory & storage | manufacturer disclosed | manufacturer disclosed |
| NAND flash Layer 2 — Memory & storage | manufacturer disclosed | manufacturer disclosed |
| Drives Layer 2 — Memory & storage | manufacturer disclosed | manufacturer disclosed |
Only Samsung Electronics
- Leading-edge foundry layer 1
- 2.5D/3D advanced packaging layer 1
- Interposers, silicon bridges, RDL layer 1
- Controllers layer 2
Only SK Hynix
Every part SK Hynix is placed on is shared with the other company.
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
- Google TPU7x (Ironwood) rack teardown
Questions
- Do Samsung Electronics and SK Hynix compete?
- In this catalog they are both placed on 6 of the same parts, across 1 layer: HBM, DRAM, Memory modules, CXL controllers & memory expanders and 2 more. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Samsung Electronics or SK Hynix?
- Samsung Electronics has 10 placements and SK Hynix has 6. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
- Which shared parts are supply-constrained?
- HBM, DRAM. These carry a sourced constraint tag on the parts page.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.