Do Micron and Samsung Electronics compete?

In this catalog they are both placed on 7 of the same parts, across 1 layer: HBM, DRAM, Memory modules, CXL controllers & memory expanders and 3 more. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.

Which has more placements, Micron or Samsung Electronics?

Micron has 7 placements and Samsung Electronics has 10. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.

Which shared parts are supply-constrained?

HBM, DRAM. These carry a sourced constraint tag on the parts page.

Micron vs Samsung Electronics

Micron and Samsung Electronics are both placed on 7 of the same AI data center parts in this catalog, spanning layer 2. Micron appears on 7 parts in total and Samsung Electronics on 10. 2 of the shared parts are supply-constrained.

At a glance

	Micron	Samsung Electronics
Ownership	public	public
Headquarters	Boise, United States	Suwon, South Korea
Primary listing	MU	005930.KS
Market cap	992.9B USD	1403.32T KRW
Parts placed	7	10
Layers covered	1	2
Units / subsidiaries	0	0
Seen in machines	2	6

Market caps are a nightly snapshot in each listing's own currency, never converted.

What the shared parts are

HBM — High-bandwidth memory stacked directly on the same package as an AI accelerator, giving the GPU or ASIC very fast, close-range access to the memory it needs to stay fed.
DRAM — Off-package system memory — DDR5 modules for host CPUs and LPDDR5X soldered near Nvidia's Grace CPU — that holds the working data a server's processors operate on.
Memory modules — The physical DIMM (or module) that packages raw DRAM die, substrate, and management circuitry into the pluggable unit a server actually sockets.
CXL controllers & memory expanders — Chips that let a server attach an extra pool of DRAM over a CXL link rather than only through the CPU's own memory channels, expanding usable capacity beyond what fits in local DIMM slots.
3 more in the table below.

The 7 parts both make

Part	Micron	Samsung Electronics
HBMconstrained Layer 2 — Memory & storage	manufacturer disclosed	manufacturer disclosed
DRAMconstrained Layer 2 — Memory & storage	manufacturer disclosed	manufacturer disclosed
Memory modules Layer 2 — Memory & storage	in house disclosed	manufacturer disclosed
CXL controllers & memory expanders Layer 2 — Memory & storage	manufacturer inferred	manufacturer disclosed
NAND flash Layer 2 — Memory & storage	manufacturer disclosed	manufacturer disclosed
Drives Layer 2 — Memory & storage	manufacturer disclosed	manufacturer disclosed
Controllers Layer 2 — Memory & storage	manufacturer inferred	in house inferred

Only Micron

Every part Micron is placed on is shared with the other company.

Only Samsung Electronics

Leading-edge foundry layer 1
2.5D/3D advanced packaging layer 1
Interposers, silicon bridges, RDL layer 1

Named in the same machines

Nvidia GB300 NVL72 rack teardown

Questions

Do Micron and Samsung Electronics compete?: In this catalog they are both placed on 7 of the same parts, across 1 layer: HBM, DRAM, Memory modules, CXL controllers & memory expanders and 3 more. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
Which has more placements, Micron or Samsung Electronics?: Micron has 7 placements and Samsung Electronics has 10. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Which shared parts are supply-constrained?: HBM, DRAM. These carry a sourced constraint tag on the parts page.

Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.