Foxconn vs Supermicro
Foxconn and Supermicro are both placed on 3 of the same AI data center parts in this catalog, spanning layers 4, 5. Foxconn appears on 9 parts in total and Supermicro on 6.
At a glance
| Foxconn | Supermicro | |
|---|---|---|
| Ownership | public | public |
| Headquarters | New Taipei City, Taiwan | San Jose, United States |
| Primary listing | 2317.TW | SMCI |
| Market cap | 3.45T TWD | 21.3B USD |
| Parts placed | 9 | 6 |
| Layers covered | 2 | 5 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 2 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Rack-scale systems — A rack-scale system is the fully integrated cabinet of compute trays, switch trays, power shelves, cooling manifolds and busbar that ships as one wired unit rather than as discrete servers.
- GPU baseboards & compute trays — The baseboard is the printed circuit assembly that carries the GPUs (and often paired CPUs) and their direct power and interconnect, packaged into a tray that slides into the rack.
- Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.
The 3 parts both make
| Part | Foxconn | Supermicro |
|---|---|---|
| Rack-scale systems Layer 4 — Servers, racks & integration | odm inferred | oem inferred |
| GPU baseboards & compute trays Layer 4 — Servers, racks & integration | manufacturer inferred | in house inferred |
| Coolant distribution units Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | in house inferred |
Only Foxconn
- EMS, system integration & rack-level test layer 4
- Fans layer 4
- Chassis, rails, rack enclosures layer 4
- Air-cooled heatsinks & vapor chambers layer 4
- Direct-to-chip cold plates layer 5
- Rack manifolds layer 5
Only Supermicro
- AI storage systems layer 2
- Cluster management & GPU orchestration layer 11
- Containerized "AI factories" layer 9
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Foxconn and Supermicro compete?
- In this catalog they are both placed on 3 of the same parts, across 2 layers: Rack-scale systems, GPU baseboards & compute trays, Coolant distribution units. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Foxconn or Supermicro?
- Foxconn has 9 placements and Supermicro has 6. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.