Boyd vs Foxconn

Boyd and Foxconn are both placed on 4 of the same AI data center parts in this catalog, spanning layers 4, 5. Boyd appears on 5 parts in total and Foxconn on 9.

At a glance

Market caps are a nightly snapshot in each listing's own currency, never converted.

What the shared parts are

• Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
• Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
• Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
• Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.

The 4 parts both make