Foxconn vs Kaori
Foxconn and Kaori are both placed on 3 of the same AI data center parts in this catalog, spanning layer 5. Foxconn appears on 9 parts in total and Kaori on 4.
At a glance
| Foxconn | Kaori | |
|---|---|---|
| Ownership | public | public |
| Headquarters | New Taipei City, Taiwan | Taiwan |
| Primary listing | 2317.TW | 8996.TW |
| Market cap | 3.45T TWD | 145.1B TWD |
| Parts placed | 9 | 4 |
| Layers covered | 2 | 1 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
- Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
- Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.
The 3 parts both make
| Part | Foxconn | Kaori |
|---|---|---|
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | in house inferred | manufacturer inferred |
| Rack manifolds Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
| Coolant distribution units Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
Only Foxconn
- Rack-scale systems layer 4
- EMS, system integration & rack-level test layer 4
- GPU baseboards & compute trays layer 4
- Fans layer 4
- Chassis, rails, rack enclosures layer 4
- Air-cooled heatsinks & vapor chambers layer 4
Only Kaori
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Foxconn and Kaori compete?
- In this catalog they are both placed on 3 of the same parts, across 1 layer: Direct-to-chip cold plates, Rack manifolds, Coolant distribution units. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Foxconn or Kaori?
- Foxconn has 9 placements and Kaori has 4. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.