Cooler Master vs Foxconn
Cooler Master and Foxconn are both placed on 3 of the same AI data center parts in this catalog, spanning layers 4, 5. Cooler Master appears on 3 parts in total and Foxconn on 9.
At a glance
| Cooler Master | Foxconn | |
|---|---|---|
| Ownership | private | public |
| Headquarters | not on file | New Taipei City, Taiwan |
| Primary listing | none in catalog | 2317.TW |
| Market cap | 3.45T TWD | |
| Parts placed | 3 | 9 |
| Layers covered | 2 | 2 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Fans — The axial and centrifugal fans mounted in server chassis and rack trays that move air across heatsinks and boards, still needed even in racks that use liquid cooling for the highest-power chips.
- Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
The 3 parts both make
| Part | Cooler Master | Foxconn |
|---|---|---|
| Fans Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Air-cooled heatsinks & vapor chambers Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | in house inferred |
Only Cooler Master
Every part Cooler Master is placed on is shared with the other company.
Only Foxconn
- Rack-scale systems layer 4
- EMS, system integration & rack-level test layer 4
- GPU baseboards & compute trays layer 4
- Chassis, rails, rack enclosures layer 4
- Rack manifolds layer 5
- Coolant distribution units layer 5
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Cooler Master and Foxconn compete?
- In this catalog they are both placed on 3 of the same parts, across 2 layers: Fans, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Cooler Master or Foxconn?
- Cooler Master has 3 placements and Foxconn has 9. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.