AVC vs Foxconn
AVC and Foxconn are both placed on 4 of the same AI data center parts in this catalog, spanning layers 4, 5. AVC appears on 4 parts in total and Foxconn on 9.
At a glance
| AVC | Foxconn | |
|---|---|---|
| Ownership | public | public |
| Headquarters | Kaohsiung, Taiwan | New Taipei City, Taiwan |
| Primary listing | 3017.TW | 2317.TW |
| Market cap | 1.23T TWD | 3.45T TWD |
| Parts placed | 4 | 9 |
| Layers covered | 2 | 2 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Fans — The axial and centrifugal fans mounted in server chassis and rack trays that move air across heatsinks and boards, still needed even in racks that use liquid cooling for the highest-power chips.
- Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
- Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
The 4 parts both make
| Part | AVC | Foxconn |
|---|---|---|
| Fans Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Air-cooled heatsinks & vapor chambers Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | in house inferred |
| Rack manifolds Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
Only AVC
Every part AVC is placed on is shared with the other company.
Only Foxconn
- Rack-scale systems layer 4
- EMS, system integration & rack-level test layer 4
- GPU baseboards & compute trays layer 4
- Chassis, rails, rack enclosures layer 4
- Coolant distribution units layer 5
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do AVC and Foxconn compete?
- In this catalog they are both placed on 4 of the same parts, across 2 layers: Fans, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, AVC or Foxconn?
- AVC has 4 placements and Foxconn has 9. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.