What Onto Innovation makes for data centers
public
Onto Innovation is a publicly listed company. It appears on 1 part of the AI data center — Packaging & bonding equipment — in the role of manufacturer. That part sits in Layer 1 — Compute silicon & packaging. Its shares trade on US exchanges (NYSE/Nasdaq) as ONTO.
Listing
US exchanges (NYSE/Nasdaq): ONTO· 199 USD +1.75% · mkt cap 9.8B USD
Snapshot 2026-10-25T10:41:17Z — nightly, not real-time.· Chart on TradingView ↗
Exposure
1 part across 1 layer
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Packaging & bonding equipment | manufacturer | inferred | ASMPT, Applied Materials, BESI, Camtek, Disco, Hanmi Semiconductor |
Where Onto Innovation sits in the stack
Onto Innovation's placements in this catalog cover 1 part, all in layer 1, compute silicon & packaging. None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- Packaging & bonding equipment — The bonding, dicing, inspection, and molding equipment used to physically assemble and verify advanced chip packages.
Closest peers in this catalog
Disclosed customers
| Customer | % | Metric | Period | Filing |
|---|---|---|---|---|
| largest customers (combined) | 10% | receivables | 2026-06-30 | 10-Q |
| one customer | 10% | receivables | 2026-06-30 | 10-Q |
| largest customers (combined) | 10% | receivables | 2026-03-31 | 10-Q |
| one customer | 10% | receivables | 2026-03-31 | 10-Q |
| largest customers (combined) | 10% | receivables | 2026-01-03 | 10-K |
| one customer | 10% | receivables | 2026-01-03 | 10-K |
Questions about Onto Innovation
- What does Onto Innovation make for AI data centers?
- This catalog places Onto Innovation on 1 part: Packaging & bonding equipment (manufacturer).
- Is Onto Innovation publicly traded?
- Yes — Onto Innovation is listed on US exchanges (NYSE/Nasdaq) under ONTO. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Who else makes packaging & bonding equipment for AI data centers?
- ASMPT, Applied Materials, BESI, Camtek, Disco and Hanmi Semiconductor are also placed on Packaging & bonding equipment in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Onto Innovation the mix is 1 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.