What Laird makes for data centers
subsidiary · unit of DuPont
Laird is a unit of DuPont. It appears on 1 part of the AI data center — Chip-level thermal: lids, heat spreaders, TIMs — in the role of manufacturer. That part sits in Layer 1 — Compute silicon & packaging.
Exposure
1 part across 1 layer
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
Where Laird sits in the stack
Laird's placements in this catalog cover 1 part, all in layer 1, compute silicon & packaging. None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- Chip-level thermal: lids, heat spreaders, TIMs — The metal lids, heat spreaders, and thermal interface materials applied directly at the die level to move heat off an accelerator package before it ever reaches a cold plate or heat sink.
Closest peers in this catalog
Questions about Laird
- What does Laird make for AI data centers?
- This catalog places Laird on 1 part: Chip-level thermal: lids, heat spreaders, TIMs (manufacturer).
- Is Laird publicly traded?
- Not on its own — this catalog records Laird as a unit of DuPont, so the traded entity is the parent.
- Who else makes chip-level thermal: lids, heat spreaders, TIMs for AI data centers?
- Dow, Henkel, Honeywell, Jentech, Shin-Etsu and Boyd are also placed on Chip-level thermal: lids, heat spreaders, TIMs in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Laird the mix is 1 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.