Do Amphenol and Foxconn Interconnect compete?

In this catalog they are both placed on 3 of the same parts, across 2 layers: Copper: DAC / ACC / AEC cables, NVLink copper spine / backplane cartridges, Board-level connectors & sockets. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.

Which has more placements, Amphenol or Foxconn Interconnect?

Amphenol has 5 placements and Foxconn Interconnect has 3. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.

Amphenol vs Foxconn Interconnect

Amphenol and Foxconn Interconnect are both placed on 3 of the same AI data center parts in this catalog, spanning layers 3, 4. Amphenol appears on 5 parts in total and Foxconn Interconnect on 3.

At a glance

	Amphenol	Foxconn Interconnect
Ownership	public	public
Headquarters	Wallingford, United States	Hong Kong
Primary listing	APH	6088.HK
Market cap	182.7B USD	26.4B HKD
Parts placed	5	3
Layers covered	2	2
Units / subsidiaries	0	0
Seen in machines	1	1

Market caps are a nightly snapshot in each listing's own currency, never converted.

What the shared parts are

Copper: DAC / ACC / AEC cables — High-speed copper cable assemblies — DAC, ACC, and AEC types — that link GPUs, NICs, and switches over short distances as a lower-cost alternative to optical transceivers.
NVLink copper spine / backplane cartridges — The copper cable assemblies and backplane cartridges that physically wire the scale-up fabric together inside a rack, most visible in Nvidia's NVL72 architecture.
Board-level connectors & sockets — The physical connectors — CPU and GPU sockets, board-to-board and cable connectors, and I/O cages — that link chips, trays and cables together on and between boards.

The 3 parts both make

Part	Amphenol	Foxconn Interconnect
Copper: DAC / ACC / AEC cables Layer 3 — Networking & interconnect	manufacturer inferred	manufacturer inferred FIT
NVLink copper spine / backplane cartridges Layer 3 — Networking & interconnect	manufacturer reported	manufacturer reported
Board-level connectors & sockets Layer 4 — Servers, racks & integration	manufacturer inferred	manufacturer inferred

Only Amphenol

In-rack busbar & power whips layer 4
OSFP/QSFP cages layer 4

Only Foxconn Interconnect

Every part Foxconn Interconnect is placed on is shared with the other company.

Named in the same machines

Nvidia GB300 NVL72 rack teardown

Questions

Do Amphenol and Foxconn Interconnect compete?: In this catalog they are both placed on 3 of the same parts, across 2 layers: Copper: DAC / ACC / AEC cables, NVLink copper spine / backplane cartridges, Board-level connectors & sockets. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
Which has more placements, Amphenol or Foxconn Interconnect?: Amphenol has 5 placements and Foxconn Interconnect has 3. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.

Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.