Compare the three rack teardowns

Every figure below comes from the vendor's own spec sheet or product page (see each teardown's own sourcing) — nothing here is estimated except the two rows marked "computed", which are Google's own per-chip numbers multiplied by its own 64-chip rack count (Google doesn't publish an aggregate at that unit, only per-chip and per-superpod; the arithmetic checks against Google's superpod figure exactly).

GB300 NVL72AMD HeliosGoogle TPU7x
AcceleratorNVIDIA Blackwell Ultra (B300) GPUAMD Instinct MI455X GPUGoogle TPU7x (Ironwood) ASIC
Host CPUGrace CPU (36 per rack, Arm Neoverse V2)EPYC "Venice" CPU (18 per rack, Zen 6, up to 256 cores)x86 host per 4-chip set confirmed to exist (224 vCPUs); vendor not disclosed
Chips per rack727264
Memory typeHBM3eHBM4HBM3E
Memory per chip288 GB432 GB192 GB
Memory bandwidth per chip8 TB/s23.3 TB/s7.37 TB/s
Memory total per rack20.7 TB31 TB12.3 TB (computed)
FP8 compute per rack720 PFLOPS1,400 PFLOPS295 PFLOPS (computed)
FP4 compute per rack1,440 PFLOPS2,900 PFLOPS—
Scale-up bandwidth130 TB/s260 TB/s1.2 TB/s †
Scale-up fabricNVLink 5 + NVSwitch (electrical switch chips)UALink-over-Ethernet on Broadcom Tomahawk 6 ASICs (electrical switch chips)3D-torus Inter-Chip Interconnect (ICI), direct chip-to-chip, no switch chip
Scale-out bandwidth—43 TB/s—
Rack power135 kW design, up to 155 kW peak225–245 kW (DC busbar capacity)not disclosed per-rack; ~10 MW for a full 9,216-chip superpod
Rack mechanical standardNVIDIA proprietary liquid-cooled cabinetOCP Open Rack Wide (open standard, double-wide)Google proprietary

Google's own docs call a 64-chip rack a "cube" — there is no 72-chip TPU rack; 64 is the largest unit Google itself calls a rack.

† per-chip bidirectional ICI, not a rack aggregate — Google's fabric is a direct chip-to-chip mesh, not a switched network, so there is no single "aggregate bandwidth" figure comparable to NVLink/UALink

Google's TPU7x also scales far past a single rack in a way the other two don't have a published equivalent for: a 256-chip "pod" (four cubes) and a 9,216-chip "superpod" (144 cubes) connected by the same reconfigurable optical circuit switch described on its teardown page, delivering 42.5 exaFLOPS of FP8 at full superpod scale — an order of magnitude past what either GB300 or Helios racks are wired together into today.

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