https://gridtochip.site/parts/servers-racks-and-integration/high-layer-count-pcbs-hdi-backdrilled News and posts about High-layer-count PCBs on GridToChip https://www.digitimes.com/news/a20261023PD234/taiwan-packaging-pcb-manufacturing.html Mon, 26 Oct 2026 02:59:13 GMT DigiTimes https://news.skhynix.com/en/ai-infrastructure-insight-ep4 Thu, 22 Oct 2026 06:00:37 GMT Effective real-world AI application requires improvements across faster compute, wider memory bandwidth, higher-performance networking, better storage, and more stable power infrastructure. (newsroom:sk-hynix) https://www.digitimes.com/news/a20261022PD231/unimicron-pcb-demand-capacity.html Thu, 22 Oct 2026 02:27:13 GMT Unimicron warned that the rapid increase in AI demand is straining the PCB supply chain due to equipment constraints, short development cycles, and overlapping capacity bookings. (DigiTimes) https://www.digitimes.com/news/a20261021PD229/pcb-materials-capacity-expansion-hpc-ccl.html Wed, 21 Oct 2026 06:41:00 GMT The demand driven by AI and HPC is pushing PCBs towards higher density, causing an ongoing shortage of materials like copper-clad laminates, copper foil, and drill bits. (DigiTimes) https://www.digitimes.com/news/a20261021PD205/taiwan-pcb-2026-tpca-materials.html Wed, 21 Oct 2026 06:23:00 GMT Taiwan's Printed Circuit Board industry anticipates exceeding NT$1 trillion in output in 2026, fueled by increased demand from the AI infrastructure boom. (DigiTimes) https://www.digitimes.com/news/a20261021PD236/pcb-equipment-transmission-demand.html Wed, 21 Oct 2026 04:08:54 GMT The increasing need for higher data rates in AI servers is driving the upgrade of PCBs with more layers and better materials, creating high demand for advanced backdrilling equipment to maintain signal integrity. (DigiTimes) https://www.digitimes.com/news/a20261021PD204/pcb-zhen-ding-infrastructure-high-end-communications.html Wed, 21 Oct 2026 03:35:00 GMT Zhen Ding Technology displayed its latest advancements in AI server infrastructure and high-speed optical communication PCBs at the TPCA Show 2026. (DigiTimes) https://www.digitimes.com/news/a20261021PD217/topoint-pcb-materials-demand-quartz.html Wed, 21 Oct 2026 02:05:00 GMT Topoint Technology is increasing its capacity for advanced PCB drilling services to meet the growing needs of AI, HPC, and high-speed applications, showcasing support for materials like ABF substrates and quartz cloth. (DigiTimes) https://www.digitimes.com/news/a20261021PD200/tpca-unimicron-2026-taipei-taiwan.html Wed, 21 Oct 2026 01:30:00 GMT The chairman of Unimicron Technology discussed opportunities for the printed circuit board industry in the age of AI at the TPCA Show Taipei 2026. (DigiTimes) https://www.digitimes.com/news/a20261020VL220/substrate-pcb-supply-chain-wistron-hpc.html Wed, 21 Oct 2026 00:35:39 GMT Industry experts noted that close cooperation among packaging, substrate, PCB, and assembly manufacturers is crucial to overcome the technical hurdle of package-to-board integration driven by AI and HPC demands. (DigiTimes) https://www.digitimes.com/news/a20261020PD241/tongtai-demand-2027-ai-server-pcb.html Tue, 20 Oct 2026 08:02:30 GMT Increased demand for AI servers is boosting order visibility for PCB drilling equipment, with the company showcasing high-precision drilling machines. (DigiTimes) https://www.digitimes.com/news/a20261020PD200/zhen-ding-development-talent-pcb-technology.html Tue, 20 Oct 2026 01:42:24 GMT Four companies, along with National Central University, are investing in a talent development program focused on advanced printed circuit boards and industry growth. (DigiTimes) https://www.digitimes.com/news/a20261015PD238/semi-supply-chain-2035-ceo-taiwan.html Fri, 16 Oct 2026 17:53:00 GMT SEMI's CEO predicts the semiconductor industry will achieve $2 trillion in revenue by 2035, driven by AI and quantum computing growth. (DigiTimes) https://www.digitimes.com/news/a20261013VL214/pcb-ccl-ic-substrate-laminate-revenue-taiwan.html Tue, 13 Oct 2026 03:47:03 GMT Taiwanese suppliers of high-layer count PCBs and IC substrates are experiencing a widening growth gap despite the overall boom in AI server demand. (DigiTimes) https://www.digitimes.com/news/a20261006PD227/pcb-it-materials-electronics-investment.html Tue, 06 Oct 2026 07:12:11 GMT China's 15th five-year plan aims to elevate the role of printed circuit boards (PCBs) within the artificial intelligence supply chain. (DigiTimes) https://www.digitimes.com/news/a20261006PD217/pcb-supplier-manufacturing-performance-hpc.html Tue, 06 Oct 2026 04:15:35 GMT The shift to 3.2T optical interconnects is necessitating a redesign of server PCBs, which has significantly narrowed the viable supplier base to only three companies. (DigiTimes) https://www.digitimes.com/news/a20261005PD230/bangkok-flood-pcb-manufacturing-production-taiwan.html Mon, 05 Oct 2026 08:00:14 GMT Flooding in Bangkok is causing logistics disruptions for Taiwan-based PCB manufacturers operating in Thailand. (DigiTimes) https://www.digitimes.com/news/a20261002PD228/nvidia-rubin-pcb-testing-ai-server.html Fri, 02 Oct 2026 07:57:48 GMT Nvidia is considering using PTFE and HC materials to develop glass-free PCBs for its upcoming Rubin Ultra architecture. (DigiTimes) https://www.eetimes.com/ai-drives-larger-denser-packaging-raising-new-challenges-for-equipment-makers Wed, 30 Sep 2026 08:55:36 GMT The increasing demand for AI computing is driving the industry toward larger and denser chip packaging, creating significant engineering challenges for equipment and material manufacturers. (EE Times) https://www.digitimes.com/news/a20260925VL206/anthropic-infrastructure-hardware-revenue-capacity.html Fri, 25 Sep 2026 09:20:19 GMT Akamai plans to invest $5.5 billion to expand its cloud infrastructure and server capacity following a $11.6 billion, seven-year agreement with Anthropic. (DigiTimes) https://www.eetimes.com/how-ai-is-accelerating-pcb-design-and-prototyping Tue, 22 Sep 2026 07:59:35 GMT AI tools are shortening PCB design and prototyping time from months to hours, speeding up the innovation process for engineers. (EE Times) https://gridtochip.site/blog/potd-2026-09-21-high-layer-count-pcbs-hdi-backdrilled Mon, 21 Sep 2026 00:00:00 GMT Part of the day: High-layer-count PCBs — what it does, why AI changes demand for it, and who makes it. https://www.digitimes.com/news/a20260918PD231/pcb-ampoc-fareast-equipment-cpo-materials.html Sun, 20 Sep 2026 23:41:58 GMT Ampoc Far-East reported a surge in demand for its high-end PCB wet-process equipment due to AI and HPC applications, leading to capacity that is near fully booked through 2026 and for the next one to two years. (DigiTimes) https://www.hpcwire.com/off-the-wire/nsf-launches-microelectronics-initiative-for-ai-hpc-and-advanced-communications Fri, 18 Sep 2026 17:45:56 GMT The NSF announced an initiative to help U.S. manufacturers transition low-dimensional semiconductor technologies into advanced microelectronics for AI and HPC. (HPCwire) https://www.digitimes.com/news/a20260918PD208/pcb-cpo-ccl-materials-copper.html Fri, 18 Sep 2026 03:07:36 GMT The industry is speculating that increased use of Co-packaged Optics (CPO) may reduce the need for high-speed copper transmission requirements on AI server motherboards. (DigiTimes) https://www.digitimes.com/news/a20260917VL204/huawei-ai-agent-demand-infrastructure-2035.html Thu, 17 Sep 2026 02:53:45 GMT Huawei predicts that AI agents will generate 90% of token traffic by 2035, requiring substantial growth in computing, networking, storage, and power infrastructure. (DigiTimes)