# Air-cooled heatsinks & vapor chambers

Part ID: 4.17 · Layer 4 (Servers, racks & integration)

The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.

Heatsinks and vapor chambers sit directly on chips that aren't covered by a liquid cold plate (layer 5.01) — memory, networking silicon, VRMs, and, in air-cooled server configurations, the CPU or GPU itself — spreading heat across a larger surface area for fans (4.13) to carry away. As rack-scale AI systems move the highest-power chips to liquid cooling, this part's role narrows to the components liquid cooling doesn't reach and to the segment of the market still running air-cooled GPU servers rather than rack-scale liquid systems. That narrowing role doesn't mean the part disappears — it means the design problem shifts toward smaller, more thermally demanding heatsinks squeezed into a chassis that also has to route liquid-cooling plumbing, rather than large heatsinks free to use as much airflow and space as needed. For investors, this tier's growth is more tied to the air-cooled and hybrid segment of the server market than to the highest-end liquid-cooled racks, so its trajectory diverges somewhat from the rest of this layer as liquid cooling adoption increases.

**AI delta:** As the highest-power chips in a rack move to liquid cooling, heatsinks and vapor chambers narrow to the components liquid cooling doesn't reach, shrinking in scope even as they get squeezed into more crowded, liquid-plumbed chassis.

## Companies

| Company | Role | Confidence | Ownership | Ticker | Note |
|---|---|---|---|---|---|
| Auras | manufacturer | inferred | public | 3324.TWO |  |
| AVC | manufacturer | inferred | public | 3017.TW |  |
| Chaun-Choung CCI | manufacturer | inferred | public | 6230.TW |  |
| Delta Electronics | manufacturer | inferred | public | 2308.TW |  |
| Foxconn (Hon Hai) | manufacturer | inferred | public | 2317.TW |  |
| Jentech | manufacturer | inferred | public | 3653.TW |  |
| Boyd | manufacturer | inferred | private |  |  |
| Cooler Master | manufacturer | inferred | private |  |  |
| Taisol | manufacturer | inferred | private |  |  |

Confidence tags: disclosed = company/filing statement; reported = trade press or partner list; inferred = taxonomy lead.