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<title>Scale-out switch ASICs</title>
<link>https://gridtochip.site/parts/networking-and-interconnect/scale-out-switch-asics</link>
<description>News and posts about Scale-out switch ASICs on GridToChip</description>
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<title>[AI Infrastructure Insight] How AI infrastructure will be designed for the future</title>
<link>https://news.skhynix.com/en/ai-infrastructure-insight-ep4</link>
<pubDate>Thu, 22 Oct 2026 06:00:37 GMT</pubDate>
<description>Effective real-world AI application requires improvements across faster compute, wider memory bandwidth, higher-performance networking, better storage, and more stable power infrastructure. (newsroom:sk-hynix)</description>
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<title>Interview: SEMI CEO sees US$3 trillion chip industry by 2035, as trusted partners reshape supply chain</title>
<link>https://www.digitimes.com/news/a20261015PD238/semi-supply-chain-2035-ceo-taiwan.html</link>
<pubDate>Fri, 16 Oct 2026 17:53:00 GMT</pubDate>
<description>SEMI's CEO predicts the semiconductor industry will achieve $2 trillion in revenue by 2035, driven by AI and quantum computing growth. (DigiTimes)</description>
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<title>Nvidia unveils PTFE switch board at OCP, names Taiwan partners</title>
<link>https://www.digitimes.com/news/a20261015PD227/nvidia-switch-taiwan-transmission-materials.html</link>
<pubDate>Thu, 15 Oct 2026 23:57:08 GMT</pubDate>
<description>Nvidia presented a PTFE switch board at OCP and announced partnerships with Taiwanese firms. (DigiTimes)</description>
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<title>AI’s $9-Trillion Question</title>
<link>https://www.hpcwire.com/2026/10/14/ais-9-trillion-question</link>
<pubDate>Thu, 15 Oct 2026 00:33:26 GMT</pubDate>
<description>The rapid growth of the AI boom is significantly inflating costs across the supply chain, including GPUs, CPUs, memory, networking, real estate, and power infrastructure. (HPCwire)</description>
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<title>Inside the Secretive AWS Networking Lab</title>
<link>https://www.servethehome.com/inside-the-secretive-aws-networking-lab</link>
<pubDate>Wed, 14 Oct 2026 17:15:44 GMT</pubDate>
<description>The report details a tour of a private AWS networking laboratory showcasing advanced innovations in management switches, high-capacity 102.4T switches, and optical technologies. (ServeTheHome)</description>
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<title>AI chip competition shifts to data-center efficiency as memory, interconnect limits bite</title>
<link>https://www.digitimes.com/news/a20261014PD212/demand-efficiency-data-bandwidth-semiconductors.html</link>
<pubDate>Wed, 14 Oct 2026 04:14:35 GMT</pubDate>
<description>The competition in AI chip development is pivoting toward data-center efficiency to overcome scaling limitations in high-bandwidth memory and interconnect speeds. (DigiTimes)</description>
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<title>Cisco expands AI networking with new chips, SONiC, cross-site deployment</title>
<link>https://www.digitimes.com/news/a20261014PD206/cisco-chips-capacity-technology-cooling.html</link>
<pubDate>Wed, 14 Oct 2026 03:30:49 GMT</pubDate>
<description>Cisco is expanding its AI networking capabilities by deploying new switches powered by high-performance silicon and the SONiC operating system across various data center sites. (DigiTimes)</description>
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<title>Google data center strategic sourcing exec heads to OpenAI</title>
<link>https://www.datacenterdynamics.com/en/news/google-data-center-strategic-sourcing-exec-heads-to-openai</link>
<pubDate>Tue, 13 Oct 2026 16:26:47 GMT</pubDate>
<description>Google's strategic sourcing executive is joining OpenAI to focus on high-speed interconnects and rack power infrastructure. (Data Center Dynamics)</description>
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<title>Microchip Technology updates its networking and storage products to better support AI and HPC workloads</title>
<link>https://www.datacenterdynamics.com/en/news/microchip-technology-updates-its-networking-and-storage-products-to-better-support-ai-and-hpc-workloads</link>
<pubDate>Tue, 13 Oct 2026 15:21:47 GMT</pubDate>
<description>Microchip Technology has updated its networking and storage product portfolio to support the specific infrastructure requirements of AI and High-Performance Computing (HPC) workloads. (Data Center Dynamics)</description>
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<title>Micas Networks Unveils 3 102.4T Open Ethernet Platforms for AI Factories</title>
<link>https://www.hpcwire.com/off-the-wire/micas-networks-unveils-3-102-4t-open-ethernet-platforms-for-ai-factories</link>
<pubDate>Mon, 12 Oct 2026 19:13:27 GMT</pubDate>
<description>Micas Networks has launched three 102.4T Open Ethernet platforms designed for high-scale AI factory interconnects. (HPCwire)</description>
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<title>CyberTAN enters 1.6T AI switch race with Marvell-backed platform</title>
<link>https://www.digitimes.com/news/a20261012PD203/switch-cybertan-data-center-marvell-demand.html</link>
<pubDate>Mon, 12 Oct 2026 02:07:24 GMT</pubDate>
<description>CyberTAN has launched a new platform designed for 1.6T AI switching, supported by Marvell Technology. (DigiTimes)</description>
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<title>Growing pains: how distributed AI training changes the network between datacenters</title>
<link>https://www.theregister.com/networks/2026/10/09/sponsored-growing-pains-how-distributed-ai-training-changes-the-network-between-datacenters/5301554</link>
<pubDate>Fri, 09 Oct 2026 15:00:00 GMT</pubDate>
<description>The article discusses how distributed AI training requirements are necessitating more robust and low-latency network architectures between data centers. (The Register)</description>
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<title>Marvell's custom AI chip upgrade points to a broader fight over peripherals</title>
<link>https://www.digitimes.com/news/a20261008PD236/marvell-ai-chip-market-chips-revenue.html</link>
<pubDate>Thu, 08 Oct 2026 03:47:04 GMT</pubDate>
<description>Marvell is highlighting the importance of custom silicon and high-speed interconnect peripherals in the broader AI infrastructure landscape. (DigiTimes)</description>
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<title>Huawei's NPO bet challenges CPO's path to AI scale</title>
<link>https://www.digitimes.com/news/a20261007VL203/huawei-cpo-optics-ascend-cost.html</link>
<pubDate>Wed, 07 Oct 2026 01:55:00 GMT</pubDate>
<description>Huawei is positioning its NPO (Network Processor Optical) technology as an alternative to CPO (Co-packaged Optics) to address the scaling challenges of AI infrastructure. (DigiTimes)</description>
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<title>Marvell raises 2028 revenue outlook to US$20 billion as AI connectivity expands</title>
<link>https://www.digitimes.com/news/a20261007VL201/marvell-revenue-2028-outlook-infrastructure.html</link>
<pubDate>Wed, 07 Oct 2026 00:51:44 GMT</pubDate>
<description>Marvell Technology raised its 2028 revenue outlook to $20 billion, driven by growing demand for AI connectivity infrastructure. (DigiTimes)</description>
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<title>3.2T optical upgrade triggers PCB redesign, shrinking supplier pool to 3</title>
<link>https://www.digitimes.com/news/a20261006PD217/pcb-supplier-manufacturing-performance-hpc.html</link>
<pubDate>Tue, 06 Oct 2026 04:15:35 GMT</pubDate>
<description>The shift to 3.2T optical interconnects is necessitating a redesign of server PCBs, which has significantly narrowed the viable supplier base to only three companies. (DigiTimes)</description>
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<title>CScale Exits Stealth with $145M to Build the Interconnect for Gigawatt-Scale AI</title>
<link>https://www.hpcwire.com/off-the-wire/cscale-exits-stealth-with-145-million-to-build-the-interconnect-for-gigawatt-scale-ai</link>
<pubDate>Wed, 30 Sep 2026 21:17:04 GMT</pubDate>
<description>CScale has raised $145 million in funding to develop high-density interconnect infrastructure specifically designed for gigawatt-scale AI data centers. (HPCwire)</description>
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<title>EuroHPC Builds HPC and AI Ties with Latin America and the Caribbean</title>
<link>https://www.hpcwire.com/off-the-wire/eurohpc-builds-hpc-and-ai-ties-with-latin-america-and-the-caribbean</link>
<pubDate>Thu, 24 Sep 2026 17:22:23 GMT</pubDate>
<description>EuroHPC launched the EU-LAC Supercomputing Network for AI to enhance HPC and AI cooperation between Latin America, the Caribbean, and the European Union. (HPCwire)</description>
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<title>Sponsored: Huawei unveils new UnifiedBus computing architecture for SuperPoDs and clusters</title>
<link>https://www.datacenterdynamics.com/en/product-news/huawei-unveils-new-unifiedbus-computing-architecture-for-superpods-and-clusters</link>
<pubDate>Thu, 24 Sep 2026 07:00:00 GMT</pubDate>
<description>Huawei launched the UnifiedBus architecture to interconnect clusters and SuperPoDs, addressing increasing demand for computing power. (Data Center Dynamics)</description>
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<title>Internet2 and Cisco Add AI Capacity to the National Research Platform</title>
<link>https://www.hpcwire.com/off-the-wire/internet2-and-cisco-add-ai-capacity-to-the-national-research-platform</link>
<pubDate>Tue, 22 Sep 2026 19:52:11 GMT</pubDate>
<description>Internet2 and Cisco are deploying new AI PODs at two universities to increase shared computing capacity for research and education. (HPCwire)</description>
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<title>Loyalty Founder Enterprise sees AI server expansion lifting growth outlook</title>
<link>https://www.digitimes.com/news/a20260921PD200/founder-growth-expansion-production-supplier.html</link>
<pubDate>Mon, 21 Sep 2026 23:06:36 GMT</pubDate>
<description>Loyalty Founder Enterprise is leveraging the strong demand for AI infrastructure to boost its growth and profitability by expanding its offerings in AI servers, storage, and networking. (DigiTimes)</description>
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<title>Huawei details AI accelerator roadmap, pulls in next-generation Ascend NPUs by several quarters — FP4 performance of the Ascend 960PR doubles expectations</title>
<link>https://www.tomshardware.com/tech-industry/artificial-intelligence/huawei-details-ai-accelerator-roadmap-pulls-in-next-generation-ascend-npus-by-quarters-fp4-performance-of-the-ascend-960pr-doubles-expectations</link>
<pubDate>Fri, 18 Sep 2026 10:30:00 GMT</pubDate>
<description>Huawei detailed its AI accelerator roadmap, including next-generation Ascend NPUs, Kunpeng CPUs, and connectivity solutions. (Tom's Hardware)</description>
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<title>Japan's NTT Docomo deploys Nokia's latest Open RAN kit</title>
<link>https://www.datacenterdynamics.com/en/news/japans-ntt-docomo-deploys-nokias-latest-open-ran-kit</link>
<pubDate>Tue, 15 Sep 2026 16:14:50 GMT</pubDate>
<description>NTT Docomo is deploying a new Open RAN kit provided by Nokia. (Data Center Dynamics)</description>
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<title>OEM/EMS AI servers: August revenue trends, operational outlook</title>
<link>https://www.digitimes.com/news/a20260915VL212/revenue-taiwan-growth-infrastructure-demand.html</link>
<pubDate>Tue, 15 Sep 2026 05:48:41 GMT</pubDate>
<description>The electronics manufacturing sector shows massive revenue growth in AI hardware, contrasting with difficulties in the consumer device market. (DigiTimes)</description>
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<title>AI server exports to US slow; electronics parts jump 1.5 times in August</title>
<link>https://www.digitimes.com/news/a20260910PD202/exports-taiwan-electronics-2025-ai-server.html</link>
<pubDate>Sun, 13 Sep 2026 00:23:08 GMT</pubDate>
<description>Taiwan reported that electronic parts exports reached a record high of $32.22 billion in August 2026, with integrated circuits and printed circuit boards seeing significant growth. (DigiTimes)</description>
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<title>Part of the day: Scale-out switch ASICs</title>
<link>https://gridtochip.site/blog/potd-2026-09-05-scale-out-switch-asics</link>
<pubDate>Sat, 05 Sep 2026 00:00:00 GMT</pubDate>
<description>Part of the day: Scale-out switch ASICs — what it does, why AI changes demand for it, and who makes it.</description>
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