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<rss version="2.0">
<channel>
<title>Copper: DAC / ACC / AEC cables</title>
<link>https://gridtochip.site/parts/networking-and-interconnect/copper-dac-acc-aec-cables</link>
<description>News and posts about Copper: DAC / ACC / AEC cables on GridToChip</description>
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<title>Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows</title>
<link>https://www.digitimes.com/news/a20261015PD237/2027-touch-taiwan-packaging-siph-expo.html</link>
<pubDate>Thu, 15 Oct 2026 08:25:00 GMT</pubDate>
<description>The Touch Taiwan 2027 event is expanding its scope to include dedicated exhibitions for advanced packaging and silicon photonics technology to address AI and high-performance computing demands. (DigiTimes)</description>
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<title>Sponsored: What really breaks at 128K: Approaching fiber architectures at scale</title>
<link>https://www.datacenterdynamics.com/en/marketwatch/what-really-breaks-at-128k-approaching-fiber-architectures-at-scale</link>
<pubDate>Thu, 15 Oct 2026 08:00:00 GMT</pubDate>
<description>The article discusses the engineering challenges and systemic requirements of building high-density fiber architectures for large-scale AI infrastructure. (Data Center Dynamics)</description>
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<title>Quantum firm Xanadu partners with GlobalFoundries for photonic component development</title>
<link>https://www.datacenterdynamics.com/en/news/quantum-firm-xanadu-partners-with-globalfoundries-for-photonic-component-development</link>
<pubDate>Wed, 07 Oct 2026 12:06:13 GMT</pubDate>
<description>Quantum computing company Xanadu has partnered with GlobalFoundries to develop photonic components, likely leveraging advanced foundry capabilities for silicon photonics. (Data Center Dynamics)</description>
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<title>CScale Exits Stealth with $145M to Build the Interconnect for Gigawatt-Scale AI</title>
<link>https://www.hpcwire.com/off-the-wire/cscale-exits-stealth-with-145-million-to-build-the-interconnect-for-gigawatt-scale-ai</link>
<pubDate>Wed, 30 Sep 2026 21:17:04 GMT</pubDate>
<description>CScale has raised $145 million in funding to develop high-density interconnect infrastructure specifically designed for gigawatt-scale AI data centers. (HPCwire)</description>
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<title>Lightmatter Joins Open CPX MSA, Introduces Bidirectional CPX Optical Engine</title>
<link>https://www.hpcwire.com/off-the-wire/lightmatter-joins-open-cpx-msa-introduces-bidirectional-cpx-optical-engine</link>
<pubDate>Fri, 18 Sep 2026 04:36:34 GMT</pubDate>
<description>Lightmatter joined the Open CPX MSA and launched the Passage L20 CPX module, an Open CPX module designed to reduce optical cabling in AI scale-up networks by combining transmit and receive on a single fiber. (HPCwire)</description>
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<title>FIT ramps up optical interconnect push as AI race shifts to connectivity</title>
<link>https://www.digitimes.com/news/a20260916PD244/fit-data-communications-development-2026.html</link>
<pubDate>Thu, 17 Sep 2026 03:55:00 GMT</pubDate>
<description>FIT chairman Sidney Lu stated that the focus of AI advancement is shifting from computing power to improving connectivity and data flow efficiency within and across data centers. (DigiTimes)</description>
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<title>AI server exports to US slow; electronics parts jump 1.5 times in August</title>
<link>https://www.digitimes.com/news/a20260910PD202/exports-taiwan-electronics-2025-ai-server.html</link>
<pubDate>Sun, 13 Sep 2026 00:23:08 GMT</pubDate>
<description>Taiwan reported that electronic parts exports reached a record high of $32.22 billion in August 2026, with integrated circuits and printed circuit boards seeing significant growth. (DigiTimes)</description>
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<title>Part of the day: Copper: DAC / ACC / AEC cables</title>
<link>https://gridtochip.site/blog/potd-2026-09-12-copper-dac-acc-aec-cables</link>
<pubDate>Sat, 12 Sep 2026 00:00:00 GMT</pubDate>
<description>Part of the day: Copper: DAC / ACC / AEC cables — what it does, why AI changes demand for it, and who makes it.</description>
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<title>Data Movement’s Where the Value Is, Says Former Cray CEO Ungaro</title>
<link>https://www.hpcwire.com/2026/09/08/data-movements-where-the-value-is-says-former-cray-ceo-ungaro</link>
<pubDate>Tue, 08 Sep 2026 20:28:21 GMT</pubDate>
<description>Former Cray CEO Peter Ungaro stated that the primary value in the current market lies in data movement, not just raw compute capacity. (HPCwire)</description>
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<title>JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times</title>
<link>https://www.digitimes.com/news/a20260902PD226/jpc-demand-2027-infrastructure-2026.html</link>
<pubDate>Wed, 02 Sep 2026 23:33:27 GMT</pubDate>
<description>JPC Connectivity reported that AI demand continues to boost orders for its optical communications, high-speed transmission, and power products, extending visibility into 2027 and 2028. (DigiTimes)</description>
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<title>The Link Budget Is Decided at the Connector</title>
<link>https://www.eetimes.com/the-link-budget-is-decided-at-the-connector</link>
<pubDate>Tue, 01 Sep 2026 14:27:31 GMT</pubDate>
<description>The article discusses how the physical connector and its specific electrical characteristics determine the link budget and signal integrity for high-speed data center networking. (EE Times)</description>
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</channel>
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