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<title>HBM</title>
<link>https://ai-dc-parts.pages.dev/parts/memory-and-storage/hbm-hbm3e-hbm4</link>
<description>News and posts about HBM on AI Data Center Parts</description>
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<title>Samsung eyes zHBM products from 2029 as heat remains key hurdle</title>
<link>https://www.digitimes.com/news/a20260828VL208/samsung-bandwidth-packaging-3d-president.html</link>
<pubDate>Fri, 28 Aug 2026 03:45:00 GMT</pubDate>
<description>Samsung anticipates its first-generation zHBM products by 2029, noting that heat management remains a primary engineering challenge for stacking HBM over AI accelerators. (DigiTimes)</description>
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<title>SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”</title>
<link>https://news.skhynix.com/en/sk-hynix-holds-groundbreaking-ceremony-for-hbm-production-base-in-indiana-beginning-a-new-future-for-us-korea-ai</link>
<pubDate>Fri, 28 Aug 2026 02:46:45 GMT</pubDate>
<description>SK hynix held a groundbreaking ceremony for its HBM production facility in Indiana. (newsroom:sk-hynix)</description>
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<title>SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”</title>
<link>https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana-3</link>
<pubDate>Fri, 28 Aug 2026 02:44:52 GMT</pubDate>
<description>SK hynix held an event to begin building a new production facility for HBM in Indiana. (newsroom:sk-hynix)</description>
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<title>SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”</title>
<link>https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana-2</link>
<pubDate>Fri, 28 Aug 2026 02:41:28 GMT</pubDate>
<description>SK hynix began construction of an HBM production facility in Indiana as part of a new US-Korea AI effort. (newsroom:sk-hynix)</description>
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<title>SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM</title>
<link>https://www.digitimes.com/news/a20260828VL202/sk-hynix-hbm-packaging-plant-usa-production.html</link>
<pubDate>Fri, 28 Aug 2026 01:00:07 GMT</pubDate>
<description>SK hynix initiated construction on a US$4 billion advanced packaging facility in Indiana dedicated to handling High Bandwidth Memory (HBM). (DigiTimes)</description>
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<title>NVIDIA NVLink Fusion Expands with NVHBM Custom High-Bandwidth Memory</title>
<link>https://www.hpcwire.com/off-the-wire/nvidia-nvlink-fusion-expands-with-nvhbm-custom-high-bandwidth-memory</link>
<pubDate>Thu, 27 Aug 2026 19:33:55 GMT</pubDate>
<description>Amazon's Annapurna Labs is set to collaborate with NVIDIA on the development of NVHBM technology alongside NVLink Fusion for next-generation AI workloads. (HPCwire)</description>
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<title>SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”</title>
<link>https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana-01</link>
<pubDate>Thu, 27 Aug 2026 16:21:49 GMT</pubDate>
<description>SK hynix is constructing a new advanced packaging production base in Indiana to support HBM manufacturing. (newsroom:sk-hynix)</description>
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<title>Oxmiq Labs HBF in AI Compute at Hot Chips 2026</title>
<link>https://www.servethehome.com/oxmiq-labs-hbf-in-ai-compute-at-hot-chips-2026</link>
<pubDate>Thu, 27 Aug 2026 16:13:39 GMT</pubDate>
<description>At Hot Chips 2026, Oxmiq Labs analyzed the potential of HBF compared to HBM in the context of AI compute. (ServeTheHome)</description>
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<title>SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”</title>
<link>https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana</link>
<pubDate>Thu, 27 Aug 2026 16:01:24 GMT</pubDate>
<description>SK hynix is investing over $4 billion in an Indiana fab to establish U.S.-based mass production of next-generation HBM starting in the second half of 2029. (newsroom:sk-hynix)</description>
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<title>Nvidia custom 'NVHBM' promises 30% higher bandwidth, 15% lower power than commodity HBM4e — custom base die and PHY will be available to NVLink Fusion partners</title>
<link>https://www.tomshardware.com/pc-components/dram/nvidia-custom-nvhbm-promises-30-percent-higher-bandwidth-15-percent-lower-power-than-commodity-hbm4e-custom-base-die-and-phy-will-be-available-to-nvlink-fusion-partners</link>
<pubDate>Wed, 26 Aug 2026 22:45:22 GMT</pubDate>
<description>Nvidia introduced NVHBM, a custom high-bandwidth memory product offering superior performance and efficiency compared to standard HBM4e for its NVLink Fusion partners. (Tom's Hardware)</description>
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<title>Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die</title>
<link>https://www.tomshardware.com/tech-industry/semiconductors/d-matrix-stacks-its-ai-accelerator-directly-on-custom-dram-for-100-tbs-per-card</link>
<pubDate>Wed, 26 Aug 2026 12:00:00 GMT</pubDate>
<description>d-Matrix showcased Raptor, a 3D DRAM accelerator that bonds a TSMC 4nm compute die directly onto a custom DRAM die. (Tom's Hardware)</description>
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<title>SK hynix Presents a Full Lineup of Memory Solutions Optimized for AI Infrastructure at DTF 2026</title>
<link>https://news.skhynix.com/en/dtf-2026-4</link>
<pubDate>Wed, 26 Aug 2026 01:29:46 GMT</pubDate>
<description>SK hynix displayed a complete range of memory solutions optimized for AI infrastructure at DTF 2026. (newsroom:sk-hynix)</description>
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<title>Huawei Ascend Production Ramp: Die Banks, TSMC Continued Production, HBM is The Bottleneck</title>
<link>https://semianalysis.com/2025/09/08/huawei-ascend-production-ramp</link>
<pubDate>Mon, 08 Sep 2025 09:54:57 GMT</pubDate>
<description>The production of AI compute is highly dependent on the supply chain, with high bandwidth memory (HBM) currently cited as the main bottleneck. (SemiAnalysis)</description>
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