https://gridtochip.site/parts/compute-silicon-and-packaging/packaging-and-bonding-equipment News and posts about Packaging & bonding equipment on GridToChip https://www.digitimes.com/news/a20261023PD211/tsmc-texas-expansion-development-supply-chain.html Fri, 23 Oct 2026 00:50:57 GMT TSMC is evaluating Texas as a potential location for future US manufacturing capacity and considering a cooperative agreement with Terafab. (DigiTimes) https://www.digitimes.com/news/a20261022PD241/taiwan-substrate-packaging-hpc-development.html Thu, 22 Oct 2026 08:36:11 GMT The Advanced Electronic Packaging Technology committee is increasing its presence in Taiwan to advance standards for packaging and substrates. (DigiTimes) https://www.digitimes.com/news/a20261022PD235/fab-arizona-revenue-materials-equipment.html Thu, 22 Oct 2026 07:19:07 GMT Chi Yi Hsin Technology has reported a substantial order backlog for its advanced-process and packaging facilities in Arizona, with work continuing through 2028 and visibility to 2030. (DigiTimes) https://www.digitimes.com/news/a20261022VL219/texas-instruments-sales-data-growth-revenue.html Thu, 22 Oct 2026 05:59:17 GMT Texas Instruments reported strong third-quarter sales driven by demand in industrial, automotive, and data center sectors, despite facing tight chip supply while ramping up production capacity. (DigiTimes) https://www.digitimes.com/news/a20261022PD229/elon-musk-equipment-tesla-materials-spacex.html Thu, 22 Oct 2026 04:06:20 GMT Elon Musk's Terafab project is reportedly engaging with multiple South Korean suppliers covering semiconductor materials, piping, wastewater recycling, and testing components. (DigiTimes) https://www.digitimes.com/news/a20261022PR201/nvidia-capacity-testing-substrate-packaging.html Thu, 22 Oct 2026 01:59:00 GMT Nvidia is collaborating with six suppliers to increase the manufacturing capacity for substrates, advanced packaging, testing, and optical engines to satisfy demand for its AI platforms. (DigiTimes) https://www.digitimes.com/news/a20261021PD251/elon-musk-production-supplier-equipment-spacex.html Thu, 22 Oct 2026 01:10:05 GMT Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea across various components and process materials for the entire supply chain. (DigiTimes) https://www.eetimes.com/why-chip-design-ai-benchmarks-must-go-beyond-functional-correctness Wed, 21 Oct 2026 13:00:00 GMT The increasing need for specialized architectures across various domains like physical AI and edge devices is driving a demand for custom silicon optimized for specific performance, memory bandwidth, and energy targets. (EE Times) https://www.digitimes.com/news/a20261020PD241/tongtai-demand-2027-ai-server-pcb.html Tue, 20 Oct 2026 08:02:30 GMT Increased demand for AI servers is boosting order visibility for PCB drilling equipment, with the company showcasing high-precision drilling machines. (DigiTimes) https://www.digitimes.com/news/a20261020VL203/amkor-investment-packaging-expansion-capacity.html Tue, 20 Oct 2026 03:25:00 GMT Amkor Technology is significantly increasing its investment in Gwangju to boost advanced packaging capabilities required for AI and high-performance computing. (DigiTimes) https://www.digitimes.com/news/a20261020VL200/sk-hynix-loan-government-trinity-commercial.html Tue, 20 Oct 2026 02:45:16 GMT South Korean government entities launched a KRW2 trillion loan guarantee program to bolster semiconductor materials, parts, and equipment suppliers. (DigiTimes) https://www.digitimes.com/news/a20261020VL205/hanmi-packaging-subsidiary-silicon-valley-equipment.html Tue, 20 Oct 2026 01:54:57 GMT Hanmi Semiconductor has opened a US subsidiary in Silicon Valley to meet the growing demand for advanced semiconductor packaging equipment fueled by AI chip expansion. (DigiTimes) https://www.digitimes.com/news/a20261019PD232/equipment-packaging-market-panel-technology.html Mon, 19 Oct 2026 05:55:00 GMT Von Ardenne is developing flexible equipment aimed at the underdeveloped segment of panel-level packaging. (DigiTimes) https://www.digitimes.com/news/a20261015PD238/semi-supply-chain-2035-ceo-taiwan.html Fri, 16 Oct 2026 17:53:00 GMT SEMI's CEO predicts the semiconductor industry will achieve $2 trillion in revenue by 2035, driven by AI and quantum computing growth. (DigiTimes) https://www.tomshardware.com/tech-industry/semiconductors/taiwan-raising-usd4-billion-to-build-industrial-park-in-texas-to-support-us-chipmaking-supply-chain-project-to-support-countless-small-manufacturers-crucial-to-tsmc-foxconn-supply-chain Fri, 16 Oct 2026 11:57:18 GMT Taiwan plans to build a $4 billion industrial park in Texas to help smaller Taiwanese companies expand their presence supporting major chipmakers. (Tom's Hardware) https://www.digitimes.com/news/a20261014VL217/rrp-electronics-mumbai-packaging-chairman-testing.html Thu, 15 Oct 2026 07:59:00 GMT RRP Electronics has opened a new facility in Navi Mumbai for Advanced Wafer-Level Packaging (AWLP) and SIM/eSIM module production. (DigiTimes) https://www.digitimes.com/news/a20261015VL211/equipment-amec-high-end-market-manufacturing.html Thu, 15 Oct 2026 07:24:26 GMT Chinese semiconductor equipment manufacturer AMEC has announced a US$1.94 billion R&D plan to develop 102 new equipment models, expanding its portfolio into thin-film deposition and advanced packaging. (DigiTimes) https://www.digitimes.com/news/a20261015VL215/samsung-applied-materials-packaging-venture-capital-technology.html Thu, 15 Oct 2026 04:27:39 GMT Samsung Ventures and Applied Materials' venture arm invested in Flexcompute to develop simulation technology for predicting and managing deformation in advanced semiconductor packaging. (DigiTimes) https://www.digitimes.com/news/a20261015PD211/applied-materials-packaging-revenue-growth-equipment.html Thu, 15 Oct 2026 02:23:47 GMT Applied Materials projects over $5 billion in revenue from its advanced packaging business as AI chip demand drives the transition to multi-die designs. (DigiTimes) https://www.digitimes.com/news/a20261015PD213/inspection-equipment-mlcc-delta-electronics-component.html Thu, 15 Oct 2026 02:17:17 GMT Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a Delta Electronics subsidiary. (DigiTimes) https://www.eetimes.com/beyond-lithography-3d-scaling-puts-new-demands-on-materials Wed, 14 Oct 2026 18:29:24 GMT ASM International discusses the critical role of materials and process innovations required to support increasingly complex 3D semiconductor packaging and scaling. (EE Times) https://www.digitimes.com/news/a20261014VL213/equipment-hbm4-sk-hynix-2027-investment.html Wed, 14 Oct 2026 07:25:32 GMT SK Hynix has reportedly deferred some HBM4 production equipment installations until 2027. (DigiTimes) https://www.digitimes.com/news/a20261014PD210/broadcom-packaging-materials-asic-performance.html Wed, 14 Oct 2026 04:11:30 GMT A Broadcom executive emphasized that semiconductor manufacturers must simultaneously address advanced packaging challenges and power consumption limits to support next-generation hardware. (DigiTimes) https://www.digitimes.com/news/a20261014PD226/applied-materials-ceo-technology-manufacturing-capacity.html Wed, 14 Oct 2026 02:47:58 GMT The CEO of Applied Materials stated that the AI race's success depends on both technological advancement and available capacity in the semiconductor supply chain. (DigiTimes) https://www.eetimes.com/europe-advanced-packaging-gap-fraunhofer-swissbit-target-the-missing-middle Tue, 13 Oct 2026 09:06:10 GMT Fraunhofer and Swissbit are collaborating to address the shortage in the 'missing middle' of advanced packaging for high-performance computing and AI hardware. (EE Times)