https://gridtochip.site/parts/compute-silicon-and-packaging/interposers-silicon-bridges-rdl News and posts about Interposers, silicon bridges, RDL on GridToChip https://www.digitimes.com/news/a20261023PD240/nvidia-cpo-interposer-technology-2026.html Sun, 25 Oct 2026 00:45:44 GMT DigiTimes https://www.digitimes.com/news/a20261021PD223/performance-3d-tsmc-demand-design.html Wed, 21 Oct 2026 02:17:39 GMT The semiconductor industry's focus for AI computing is shifting towards 3D architectures, making power efficiency the primary measure of improvement. (DigiTimes) https://www.digitimes.com/news/a20261021PD203/contrel-laser-packaging-high-end-dual-core.html Wed, 21 Oct 2026 00:37:05 GMT Contrel and FSE presented combined laser and plasma process technologies at TPCA Show 2026, focusing on applications in advanced packaging and high-end substrate manufacturing. (DigiTimes) https://www.digitimes.com/news/a20261020PD237/auo-substrate-lcd-packaging-osat.html Tue, 20 Oct 2026 07:38:00 GMT AUO is customizing its glass core substrate specifications for semiconductor process needs instead of focusing on panel size competition, aiming to supply OSAT leaders like ASE and Powertech. (DigiTimes) https://www.digitimes.com/news/a20261020PD226/substrate-packaging-manufacturing-accelerator-capacity.html Tue, 20 Oct 2026 04:02:07 GMT The increasing size, layer count, and power demands of accelerator substrates are causing the primary industry bottleneck to shift from design limitations to physical manufacturing capacity. (DigiTimes) https://www.digitimes.com/news/a20261016VL216/equipment-semco-expansion-production-substrate.html Sat, 17 Oct 2026 00:07:22 GMT Samsung Electro-Mechanics' planned expansion for AI server substrate production is reportedly facing equipment supply constraints and longer delivery times from machinery manufacturers. (DigiTimes) https://www.digitimes.com/news/a20261016PD220/capacity-globalfoundries-packaging-tsmc-wafer.html Fri, 16 Oct 2026 03:53:56 GMT The agreement between TSMC and GF suggests that advanced packaging techniques, such as those involving 2.5D/3D integration and interposers, are being applied to mature semiconductor nodes, which impacts the electronics supply chain. (DigiTimes) https://www.digitimes.com/news/a20261015PD220/tsmc-globalfoundries-cowos-manufacturing-silicon.html Thu, 15 Oct 2026 04:00:19 GMT GlobalFoundries has signed a multi-year agreement with TSMC to provide silicon interposer capacity for its CoWoS advanced packaging ecosystem at its Malta facility. (DigiTimes) https://www.eetimes.com/beyond-lithography-3d-scaling-puts-new-demands-on-materials Wed, 14 Oct 2026 18:29:24 GMT ASM International discusses the critical role of materials and process innovations required to support increasingly complex 3D semiconductor packaging and scaling. (EE Times) https://www.tomshardware.com/tech-industry/semiconductors/analyzing-intels-emib-and-foveros-advanced-packaging-roadmaps-how-intel-plans-to-scale-chips-in-every-direction Wed, 14 Oct 2026 12:50:00 GMT The report analyzes the current status and future trajectory of Intel's EMIB and Foveros advanced packaging technologies. (Tom's Hardware) https://www.eetimes.com/europe-advanced-packaging-gap-fraunhofer-swissbit-target-the-missing-middle Tue, 13 Oct 2026 09:06:10 GMT Fraunhofer and Swissbit are collaborating to address the shortage in the 'missing middle' of advanced packaging for high-performance computing and AI hardware. (EE Times) https://www.digitimes.com/news/a20261012VL211/samsung-sk-hynix-asml-equipment-revenue.html Mon, 12 Oct 2026 03:12:32 GMT Samsung and SK Hynix have reportedly agreed to a 10% price increase from ASML for semiconductor manufacturing equipment and parts. (DigiTimes) https://www.digitimes.com/news/a20261008PD253/tpca-2026-unimicron-demand-hardware.html Sat, 10 Oct 2026 06:27:51 GMT The TPCA Show 2026 will feature a keynote from Unimicron focusing on advancements in substrate materials and high-layer-count packaging for AI computing. (DigiTimes) https://www.digitimes.com/news/a20261008VL226/malaysia-packaging-manufacturing-growth-yole.html Sat, 10 Oct 2026 06:26:21 GMT An analyst from Yole highlights Malaysia's growing role in the semiconductor supply chain, specifically noting the importance of advanced packaging technologies driven by AI demand. (DigiTimes) https://www.eetimes.com/connecting-chiplets-isnt-enough-solving-the-data-movement-challenge-in-multi-die-systems Fri, 09 Oct 2026 14:21:07 GMT The article discusses the technical challenges of data movement in multi-die systems, highlighting that interconnecting chiplets is only one part of the architecture required for high-performance computing. (EE Times) https://www.digitimes.com/news/a20261009VL200/tsmc-globalfoundries-packaging-cowos-silicon.html Fri, 09 Oct 2026 02:43:17 GMT GlobalFoundries has secured a $2 billion deal from TSMC to manufacture interposers, addressing a supply gap in the US semiconductor packaging market. (DigiTimes) https://www.digitimes.com/news/a20261007PD242/applied-materials-intel-ai-chip-manufacturing-development.html Fri, 09 Oct 2026 01:42:39 GMT Applied Materials and Intel are collaborating to address AI chip bottlenecks by focusing on interconnect scaling and Foveros 3D packaging technologies. (DigiTimes) https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion Thu, 08 Oct 2026 18:23:28 GMT GlobalFoundries has signed a $2 billion, five-year agreement to manufacture silicon interposers in the United States for TSMC's CoWoS packaging technology. (Tom's Hardware) https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion Thu, 08 Oct 2026 18:23:28 GMT GlobalFoundries has announced it will manufacture silicon interposers in the United States to support TSMC's CoWoS advanced packaging technology. (Tom's Hardware) https://www.theregister.com/systems/2026/10/08/tsmc-taps-globalfoundries-to-bolster-us-silicon-interposer-production-in-2b-deal/5302061 Thu, 08 Oct 2026 17:22:32 GMT TSMC has entered into a $2 billion agreement with GlobalFoundries to increase the production of silicon interposers within the United States. (The Register) https://www.digitimes.com/news/a20261006PD221/nittobo-demand-ai-chip-production-market.html Tue, 06 Oct 2026 04:47:47 GMT Nittobo is increasing production of glass cloth materials to meet the rising demand for glass-core substrates and reinforced materials used in AI chip packaging. (DigiTimes) https://www.digitimes.com/news/a20261002PD208/packaging-equipment-materials-display-chipmakers.html Fri, 02 Oct 2026 02:16:23 GMT The competition for advanced packaging leadership is expanding to include display, materials, and equipment suppliers seeking to secure positions in the high-end chip manufacturing ecosystem. (DigiTimes) https://www.eetimes.com/ai-drives-larger-denser-packaging-raising-new-challenges-for-equipment-makers Wed, 30 Sep 2026 08:55:36 GMT The increasing demand for AI computing is driving the industry toward larger and denser chip packaging, creating significant engineering challenges for equipment and material manufacturers. (EE Times) https://www.tomshardware.com/tech-industry/photonics/intel-patent-embeds-microleds-in-chip-packaging-technology-may-enable-embedded-optical-interconnects-through-tgvs Tue, 29 Sep 2026 10:30:00 GMT Intel has patented a method to embed MicroLEDs into chip packaging, a development that could facilitate optical interconnects using Through-Glass Via (TGV) technology. (Tom's Hardware) https://www.digitimes.com/news/a20260924VL213/manufacturing-production-chips-packaging-equipment.html Mon, 28 Sep 2026 00:50:46 GMT Micro Han Xin is attempting to establish a standard for miniaturized barcode traceability in the semiconductor supply chain. (DigiTimes)