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<title>Glass-core substrates</title>
<link>https://ai-dc-parts.pages.dev/parts/compute-silicon-and-packaging/glass-core-substrates-emerging</link>
<description>News and posts about Glass-core substrates on AI Data Center Parts</description>
<item>
<title>Samsung diverges from TSMC on FOPLP: retains 415&amp;times;510mm panel size, targets 2028 mass production</title>
<link>https://www.digitimes.com/news/a20260828PD216/samsung-foplp-panel-packaging-production.html</link>
<pubDate>Fri, 28 Aug 2026 03:08:37 GMT</pubDate>
<description>Samsung presented its advanced semiconductor packaging roadmap, focusing on FOPLP using glass substrates and emphasizing AI's role in future research. (DigiTimes)</description>
</item>
<item>
<title>Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping</title>
<link>https://www.tomshardware.com/tech-industry/manufacturing/glass-substrate-roadmap-examined</link>
<pubDate>Thu, 27 Aug 2026 15:40:11 GMT</pubDate>
<description>Glass-core substrates, which Intel had promised as replacements for organic chip packaging, are nearing final qualification but have yet to reach commercial availability. (Tom's Hardware)</description>
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