# CMP and chemicals

Part ID: 1.20c · Layer 1 (Compute silicon & packaging) · child of 1.20

Chemical-mechanical planarization slurries and related process chemicals used to polish and clean wafers between fabrication steps.

## Companies

| Company | Role | Confidence | Ownership | Ticker | Note |
|---|---|---|---|---|---|
| Entegris | manufacturer | inferred | public | ENTG |  |
| Fujimi | manufacturer | inferred | public | 5384.T |  |
| Merck KGaA | manufacturer | inferred | public | MRK.DE |  |
| Resonac | manufacturer | inferred | public | 4004.T |  |
| Soulbrain | manufacturer | inferred | public | 357780.KS |  |
| Stella Chemifa | manufacturer | inferred | public | 4109.T |  |

Confidence tags: disclosed = company/filing statement; reported = trade press or partner list; inferred = taxonomy lead.