https://gridtochip.site/parts/compute-silicon-and-packaging/chip-level-thermal-lids-heat-spreaders-tims News and posts about Chip-level thermal: lids, heat spreaders, TIMs on GridToChip https://www.digitimes.com/news/a20261022PD244/umc-ap-memory-silicon-packaging-technology.html Fri, 23 Oct 2026 00:36:39 GMT UMC and AP Memory partnered to develop next-generation power delivery solutions for AI data centers by integrating UMC's DTC silicon capacitor technology with AP Memory's design expertise for advanced packaging. (DigiTimes) https://www.digitimes.com/news/a20261021PD251/elon-musk-production-supplier-equipment-spacex.html Thu, 22 Oct 2026 01:10:05 GMT Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea across various components and process materials for the entire supply chain. (DigiTimes) https://www.digitimes.com/news/a20261021PD223/performance-3d-tsmc-demand-design.html Wed, 21 Oct 2026 02:17:39 GMT The semiconductor industry's focus for AI computing is shifting towards 3D architectures, making power efficiency the primary measure of improvement. (DigiTimes) https://www.eetimes.com/semicon-west-2026-displays-ai-era-chipmaking-workforce-development Fri, 16 Oct 2026 20:59:50 GMT The semiconductor industry is preparing its fabrication facilities and workforce to meet the demands of the AI era. (EE Times) https://www.tomshardware.com/pc-components/cooling/experiment-shows-liquid-metal-tim-doesnt-dry-out-it-turns-solid-two-year-electron-microscope-test-finds-gallium-bonds-with-copper-coolers-and-nickel-plating-keeps-the-layer-about-10-times-thinner Fri, 16 Oct 2026 11:00:00 GMT Testing using an electron microscope demonstrated that the liquid metal used in thermal interface material does not dry out, solidifying when it contacts copper and nickel-plated coolers. (Tom's Hardware) https://www.tomshardware.com/pc-components/liquid-cooling/diamond-infused-watercooling-coldplates-for-2-300w-nvidia-rubin-drop-temps-by-up-to-22c-bespoke-frore-liquidjet-diamond-cooling-tames-770-w-cm2-hotspots Mon, 12 Oct 2026 13:30:00 GMT Frore has introduced a LiquidJet Diamond coldplate designed for high-power Nvidia Rubin chips to achieve significant temperature reductions in water-cooled AI server systems. (Tom's Hardware) https://www.digitimes.com/news/a20261012VL202/materials-plant-subsidiary-investment-packaging.html Mon, 12 Oct 2026 03:37:26 GMT SJ Electronics is investing $70 million to construct a manufacturing facility in Penang to produce thermal materials. (DigiTimes) https://www.tomshardware.com/desktops/mini-pcs/first-intel-panther-lake-mini-pc-cooled-with-solid-state-airjet-tech-operates-at-less-than-21-dba-aaeon-claims-its-fanless-up-xtreme-ptl-edge-air-is-also-slimmer-lighter-than-actively-cooled-rivals Thu, 01 Oct 2026 15:27:09 GMT Intel has released a Panther Lake mini PC that utilizes solid-state AirJet cooling technology to maintain noise levels below 21 dBA. (Tom's Hardware) https://www.tomshardware.com/pc-components/gpus/nvidia-dlss-5-upscales-frame-rates-and-flame-temps-on-16-pin-power-connector-ai-gaming-tech-pushes-connector-to-uncomfortable-thermal-and-power-limits Fri, 25 Sep 2026 10:30:00 GMT Testing revealed that the 16-pin power connector on the RTX 5090 reaches temperatures exceeding 90 degrees Celsius when the GPU draws near 650W. (Tom's Hardware) https://www.eetimes.com/semicon-india-2026-startup-mitra-sheds-light-on-early-stage-silicon-startup-funding Thu, 24 Sep 2026 08:15:06 GMT Indian semiconductor startups require funding to move their silicon designs from early prototypes toward volume manufacturing. (EE Times) https://www.digitimes.com/news/a20260922PD239/taiwan-inspection-surveillance-performance-algorithms.html Wed, 23 Sep 2026 00:14:55 GMT Taiwan is developing AI algorithms to process low-resolution thermal images from drones, potentially reducing the cost of thermal imaging modules by 50%. (DigiTimes) https://www.digitimes.com/news/a20260918PD217/materials-niching-packaging-revenue-testing.html Fri, 18 Sep 2026 23:19:38 GMT Niching Industrial anticipates a 20% increase in 2026 revenue, driven by solid growth in IC substrates, heat spreaders, and SSD enclosures. (DigiTimes) https://www.hpcwire.com/off-the-wire/nsf-launches-microelectronics-initiative-for-ai-hpc-and-advanced-communications Fri, 18 Sep 2026 17:45:56 GMT The NSF announced an initiative to help U.S. manufacturers transition low-dimensional semiconductor technologies into advanced microelectronics for AI and HPC. (HPCwire) https://www.digitimes.com/news/a20260918VL202/semicon-equipment-materials-2026-applied-materials.html Fri, 18 Sep 2026 01:14:10 GMT Major chip companies committed to supporting the Indian semiconductor ecosystem by investing in equipment, materials, and R&D centers rather than announcing new fabs. (DigiTimes) https://www.digitimes.com/news/a20260917VL202/onsemi-design-industrial-market-revenue.html Thu, 17 Sep 2026 01:31:02 GMT Onsemi plans to leverage its semiconductor expertise to move into integrated power systems, focusing on improving power density, heat management, and overall efficiency in data centers. (DigiTimes) https://www.datacenterdynamics.com/en/news/onsemi-unveils-its-embedded-power-platform-architecture-to-increase-power-density Wed, 16 Sep 2026 18:30:29 GMT Onsemi introduced an Embedded Power Platform architecture utilizing the silicon wafer itself for embedding components and increasing power density. (Data Center Dynamics) https://www.digitimes.com/news/a20260914PD235/demand-revenue-price-umc-psmc.html Mon, 14 Sep 2026 08:54:23 GMT AI demand is increasing the revenue for power management ICs, networking chips, and specialty processes, leading to higher quotes from Taiwan foundries since 2026. (DigiTimes) https://www.digitimes.com/news/a20260910PD202/exports-taiwan-electronics-2025-ai-server.html Sun, 13 Sep 2026 00:23:08 GMT Taiwan reported that electronic parts exports reached a record high of $32.22 billion in August 2026, with integrated circuits and printed circuit boards seeing significant growth. (DigiTimes) https://www.datacenterdynamics.com/en/opinions/making-data-centers-ready-for-ai-workloads-with-rack-level-cooling Sat, 12 Sep 2026 15:00:00 GMT High-density AI workloads require advanced rack-level cooling solutions, forcing organizations to strategically decide where to deploy them. (Data Center Dynamics) https://www.digitimes.com/news/a20260910PD231/cpo-siph-silicon-testing-equipment.html Fri, 11 Sep 2026 09:19:25 GMT ficonTEC launched a new automated optical test solution to address bottlenecks in Co-packaged optics (CPO) testing, anticipating increased demand for such equipment over the next couple of years. (DigiTimes) https://www.digitimes.com/news/a20260911VL204/ai-server-revenue-taipei-materials.html Fri, 11 Sep 2026 01:54:03 GMT Taiwanese AI hardware companies reported strong August revenue growth, indicating continued acceleration in the AI data center build-out. (DigiTimes) https://www.eetimes.com/quantum-scaling-is-becoming-a-control-electronics-problem Wed, 09 Sep 2026 08:05:43 GMT The pursuit of quantum scaling necessitates moving control electronics closer to the cooling infrastructure to manage increasing complexity in wiring, heat, and latency. (EE Times) https://www.digitimes.com/news/a20260908VL206/gpu-shanghai-biren-cooling-talent.html Wed, 09 Sep 2026 00:25:01 GMT Biren Technology is collaborating with Shanghai University to jointly research AI-chip optical interconnects and advanced thermal management techniques. (DigiTimes) https://www.eetimes.com/strategy-paper-urges-canada-to-add-semiconductors-to-ai-strategy Tue, 08 Sep 2026 19:00:00 GMT A strategy paper recommended that Canada must integrate semiconductors into its national AI strategy to support its domestic hardware capabilities. (EE Times) https://www.digitimes.com/news/a20260908PD218/taiwan-re100-infrastructure-electricity-renewable-energy.html Tue, 08 Sep 2026 04:10:04 GMT Taiwan's semiconductor and AI infrastructure expansion is intensifying pressure on chip manufacturers to adopt renewables, due to prohibitive green power costs and severe power supply constraints. (DigiTimes)