https://gridtochip.site/parts/compute-silicon-and-packaging/abf-high-layer-package-substrates News and posts about ABF / high-layer package substrates on GridToChip https://www.digitimes.com/news/a20261023PD240/nvidia-cpo-interposer-technology-2026.html Sun, 25 Oct 2026 00:45:44 GMT DigiTimes https://www.digitimes.com/news/a20261023PD226/tesla-nvidia-semco-production-abf-substrate.html Fri, 23 Oct 2026 03:44:29 GMT Tesla and Nvidia are reportedly investing combined funds into Samsung Electro-Mechanics to expand ABF substrate production capacity in South Korea. (DigiTimes) https://www.digitimes.com/news/a20261021PD217/topoint-pcb-materials-demand-quartz.html Wed, 21 Oct 2026 02:05:00 GMT Topoint Technology is increasing its capacity for advanced PCB drilling services to meet the growing needs of AI, HPC, and high-speed applications, showcasing support for materials like ABF substrates and quartz cloth. (DigiTimes) https://www.digitimes.com/news/a20261021VL201/semco-demand-chips-semiconductors-bga.html Wed, 21 Oct 2026 01:23:11 GMT Samsung Electro-Mechanics won a large contract to supply package substrates for memory semiconductors due to rising AI demand. (DigiTimes) https://www.digitimes.com/news/a20261021PD206/semco-packaging-2027-2026-silicon.html Wed, 21 Oct 2026 00:45:00 GMT Samsung Electro-Mechanics signed a long-term supply agreement for memory packaging substrates, expanding its existing agreements that cover MLCCs and silicon capacitors. (DigiTimes) https://www.digitimes.com/news/a20261020VL220/substrate-pcb-supply-chain-wistron-hpc.html Wed, 21 Oct 2026 00:35:39 GMT Industry experts noted that close cooperation among packaging, substrate, PCB, and assembly manufacturers is crucial to overcome the technical hurdle of package-to-board integration driven by AI and HPC demands. (DigiTimes) https://www.digitimes.com/news/a20261016VL216/equipment-semco-expansion-production-substrate.html Sat, 17 Oct 2026 00:07:22 GMT Samsung Electro-Mechanics' planned expansion for AI server substrate production is reportedly facing equipment supply constraints and longer delivery times from machinery manufacturers. (DigiTimes) https://www.digitimes.com/news/a20261016PD228/boe-packaging-production-display-ai-chip.html Fri, 16 Oct 2026 03:42:10 GMT BOE is testing its 24-layer glass substrates for AI chip packaging, although mass production is not yet expected. (DigiTimes) https://www.eetimes.com/beyond-lithography-3d-scaling-puts-new-demands-on-materials Wed, 14 Oct 2026 18:29:24 GMT ASM International discusses the critical role of materials and process innovations required to support increasingly complex 3D semiconductor packaging and scaling. (EE Times) https://www.digitimes.com/news/a20261014PD236/ic-substrate-plant-investigation-production-inspection.html Wed, 14 Oct 2026 05:50:09 GMT Taiwanese substrate manufacturer Xinxing has suspended operations on certain machinery following a fatal workplace accident. (DigiTimes) https://www.digitimes.com/news/a20261014PD210/broadcom-packaging-materials-asic-performance.html Wed, 14 Oct 2026 04:11:30 GMT A Broadcom executive emphasized that semiconductor manufacturers must simultaneously address advanced packaging challenges and power consumption limits to support next-generation hardware. (DigiTimes) https://www.eetimes.com/europe-advanced-packaging-gap-fraunhofer-swissbit-target-the-missing-middle Tue, 13 Oct 2026 09:06:10 GMT Fraunhofer and Swissbit are collaborating to address the shortage in the 'missing middle' of advanced packaging for high-performance computing and AI hardware. (EE Times) https://www.digitimes.com/news/a20261013PD228/equipment-substrate-expansion-ic-substrate-capacity.html Tue, 13 Oct 2026 07:30:00 GMT While shortages of substrate materials for AI chips are beginning to ease, the industry is facing new bottlenecks related to the availability of advanced manufacturing equipment. (DigiTimes) https://www.digitimes.com/news/a20261013VL214/pcb-ccl-ic-substrate-laminate-revenue-taiwan.html Tue, 13 Oct 2026 03:47:03 GMT Taiwanese suppliers of high-layer count PCBs and IC substrates are experiencing a widening growth gap despite the overall boom in AI server demand. (DigiTimes) https://www.digitimes.com/news/a20261012PD249/wistron-taiwan-plant-investment-capacity.html Tue, 13 Oct 2026 03:07:43 GMT Wistron is investing NT$8 billion to expand its manufacturing capacity in Taiwan, which includes production for advanced packaging and server assembly. (DigiTimes) https://www.digitimes.com/news/a20261013PD205/nanya-technology-capacity-3d-ic-production-plant.html Tue, 13 Oct 2026 01:36:50 GMT Nanya Technology has secured long-term agreements to cover up to 70% of its production capacity at its Pingtung 3D IC plant, which is scheduled to begin production in the second half of 2028. (DigiTimes) https://www.digitimes.com/news/a20261012VL224/sumitomo-bakelite-packaging-materials-production-sumitomo.html Mon, 12 Oct 2026 07:37:29 GMT Sumitomo Bakelite is increasing its production capacity for packaging materials in Singapore and China to support growing demand. (DigiTimes) https://www.digitimes.com/news/a20261012VL211/samsung-sk-hynix-asml-equipment-revenue.html Mon, 12 Oct 2026 03:12:32 GMT Samsung and SK Hynix have reportedly agreed to a 10% price increase from ASML for semiconductor manufacturing equipment and parts. (DigiTimes) https://www.digitimes.com/news/a20261008PD253/tpca-2026-unimicron-demand-hardware.html Sat, 10 Oct 2026 06:27:51 GMT The TPCA Show 2026 will feature a keynote from Unimicron focusing on advancements in substrate materials and high-layer-count packaging for AI computing. (DigiTimes) https://www.digitimes.com/news/a20261008VL220/semco-glass-substrate-testing-expansion.html Sat, 10 Oct 2026 06:27:18 GMT Semco is transitioning the testing of glass substrates to the package level. (DigiTimes) https://www.digitimes.com/news/a20261008VL223/jntc-2028-manufacturing-glass-substrate-packaging.html Sat, 10 Oct 2026 06:27:06 GMT JNTC is investing $259 million to scale up its production of glass substrates, aiming for a full production ramp-up by 2028. (DigiTimes) https://www.digitimes.com/news/a20261008VL226/malaysia-packaging-manufacturing-growth-yole.html Sat, 10 Oct 2026 06:26:21 GMT An analyst from Yole highlights Malaysia's growing role in the semiconductor supply chain, specifically noting the importance of advanced packaging technologies driven by AI demand. (DigiTimes) https://www.digitimes.com/news/a20261008VL214/samsung-hanmi-substrate-expansion-equipment.html Thu, 08 Oct 2026 04:21:55 GMT Hanmi Semiconductor has secured a significant order from Samsung to expand its production capacity for chip substrates, supported by a $5 billion investment. (DigiTimes) https://www.digitimes.com/news/a20261006VL215/substrate-semco-expansion-capacity-investment.html Tue, 06 Oct 2026 07:05:50 GMT Samsung has secured backing for a $5 billion expansion to increase its production capacity for high-layer package substrates. (DigiTimes) https://www.digitimes.com/news/a20261003PD200/lite-on-leotek-ev-charging-expansion-kaohsiung.html Mon, 05 Oct 2026 01:48:11 GMT Lite-On is investing NT$8.85 billion to expand its facilities in Kaohsiung, while its subsidiary Leotek is acquiring AmpUp to strengthen its position in the substrate materials market. (DigiTimes) https://gridtochip.site/blog/parts-with-no-us-listed-supplier Fri, 04 Sep 2026 00:00:00 GMT 163 parts here have three or more listed suppliers. On eight, not one trades in the US — and six sit either directly under the GPU or directly around it.