2.5D/3D advanced packaging https://ai-dc-parts.pages.dev/parts/compute-silicon-and-packaging/2-5d-3d-advanced-packaging-cowos-s-l-r-soic News and posts about 2.5D/3D advanced packaging on AI Data Center Parts Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production https://www.digitimes.com/news/a20260828PD216/samsung-foplp-panel-packaging-production.html Fri, 28 Aug 2026 03:08:37 GMT Samsung presented its advanced semiconductor packaging roadmap, focusing on FOPLP using glass substrates and emphasizing AI's role in future research. (DigiTimes) Exclusive: IC design faces wire bonding bottleneck in 2027 https://www.digitimes.com/news/a20260828PD209/ic-design-wire-bonding-packaging-capacity-demand.html Fri, 28 Aug 2026 02:31:19 GMT Due to surging AI chip demand, outsourced assembly and test providers warn that traditional packaging capacity, particularly wire bonding, could face a deficit exceeding 20% by 2027. (DigiTimes) SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM https://www.digitimes.com/news/a20260828VL202/sk-hynix-hbm-packaging-plant-usa-production.html Fri, 28 Aug 2026 01:00:07 GMT SK hynix initiated construction on a US$4 billion advanced packaging facility in Indiana dedicated to handling High Bandwidth Memory (HBM). (DigiTimes) SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI” https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana-01 Thu, 27 Aug 2026 16:21:49 GMT SK hynix is constructing a new advanced packaging production base in Indiana to support HBM manufacturing. (newsroom:sk-hynix) Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die https://www.tomshardware.com/tech-industry/semiconductors/d-matrix-stacks-its-ai-accelerator-directly-on-custom-dram-for-100-tbs-per-card Wed, 26 Aug 2026 12:00:00 GMT d-Matrix showcased Raptor, a 3D DRAM accelerator that bonds a TSMC 4nm compute die directly onto a custom DRAM die. (Tom's Hardware) Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller https://www.tomshardware.com/pc-components/cpus/hot-chips-2026-arm-details-agi-server-cpu-with-two-70-core-n3p-chiplets-touts-2-tb-s-ucie-fabric-link-and-12-channel-memory-controller Wed, 26 Aug 2026 11:00:00 GMT Arm revealed details about its AGI processors, which include up to 136 cores and utilize a 2 TB/s UCIe fabric link alongside a 12-channel memory controller. (Tom's Hardware) India’s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D https://www.eetimes.com/indias-osat-atmp-build-out-from-legacy-packages-to-2-5d Wed, 26 Aug 2026 07:00:00 GMT ASIP Technologies is partnering with APACT to build an OSAT facility in India's Visakhapatnam region. (EE Times)