https://gridtochip.site/companies/together News and posts about Together on GridToChip https://www.digitimes.com/news/a20261019VL201/nvidia-hbm-tsmc-samsung-3nm.html Mon, 19 Oct 2026 01:04:27 GMT Nvidia's use of custom High Bandwidth Memory (HBM) is influencing Samsung to utilize TSMC's 3nm process. (DigiTimes) https://www.digitimes.com/news/a20261016PD240/ase-packaging-technology-materials-development.html Fri, 16 Oct 2026 07:26:37 GMT ASE announced involvement in three advanced packaging projects with universities. (DigiTimes) https://www.digitimes.com/news/a20261016VL203/data-center-financing-johor-capacity-investment.html Fri, 16 Oct 2026 02:01:25 GMT DayOne increased its financing for a data center in Johor to MYR30 billion, while also exceeding 1GW in billings. (DigiTimes) https://www.digitimes.com/news/a20261014PD210/broadcom-packaging-materials-asic-performance.html Wed, 14 Oct 2026 04:11:30 GMT A Broadcom executive emphasized that semiconductor manufacturers must simultaneously address advanced packaging challenges and power consumption limits to support next-generation hardware. (DigiTimes) https://www.hpcwire.com/off-the-wire/applied-materials-brings-chipmakers-together-at-new-epic-rd-center Tue, 13 Oct 2026 23:01:22 GMT Applied Materials is opening a new EPIC R&D center to foster collaboration between chipmakers and enhance innovation in semiconductor manufacturing equipment and materials. (HPCwire) https://www.hpcwire.com/2026/10/13/upscale-ai-launches-token-fabric-to-make-rival-ai-chips-work-together Tue, 13 Oct 2026 22:53:16 GMT Upscale AI has launched Token Fabric, a software-hardware integrated solution designed to enable interoperability between competing AI accelerators and chips. (HPCwire) https://www.datacenterdynamics.com/en/opinions/lithium-ion-vs-lead-acid-battery-technology-a-comprehensive-overview-of-fire-risks Fri, 09 Oct 2026 15:00:00 GMT The article provides a comprehensive comparison of fire risks and technical specifications between lithium-ion and lead-acid battery technologies. (Data Center Dynamics) https://www.hpcwire.com/off-the-wire/pppl-partners-on-genesis-mission-project-to-build-ai-digital-twin-for-fusion-energy Fri, 09 Oct 2026 02:58:28 GMT PPPL is partnering on the Genesis Mission Project to develop an AI-powered digital twin for fusion energy. (HPCwire) https://www.digitimes.com/news/a20261008PD233/overcapacity-semiconductors-g20-policy-production.html Thu, 08 Oct 2026 06:54:36 GMT A coalition of countries, including the US, issued a joint statement regarding global semiconductor overcapacity and the necessity of securing semiconductor supply chains. (DigiTimes) https://www.hpcwire.com/off-the-wire/applied-materials-and-intel-collaborate-on-chipmaking-innovations-for-ai-driven-computing Wed, 07 Oct 2026 21:22:50 GMT Applied Materials and Intel are collaborating on manufacturing innovations to support the production of high-performance chips required for AI computing. (HPCwire) https://www.digitimes.com/news/a20261002PD212/micron-demand-taiwan-fab-capacity.html Fri, 02 Oct 2026 02:45:47 GMT Micron is urging its Taiwanese suppliers to establish manufacturing presence outside of Taiwan as the company expands its global fabrication footprint. (DigiTimes) https://www.datacenterdynamics.com/en/product-news/castrol-launches-castrol-core-an-integrated-thermal-management-offer-for-data-centers Thu, 01 Oct 2026 07:00:00 GMT Castrol has launched Castrol CORE, a thermal management solution specifically designed for data center cooling systems. (Data Center Dynamics) https://www.digitimes.com/news/a20261001VL208/samsung-ai-agent-robotics-development-2026.html Thu, 01 Oct 2026 03:13:55 GMT Samsung's AI Forum 2026 highlighted the integration of agentic AI across various sectors including robotics and semiconductor manufacturing. (DigiTimes) https://www.hpcwire.com/off-the-wire/cscale-exits-stealth-with-145-million-to-build-the-interconnect-for-gigawatt-scale-ai Wed, 30 Sep 2026 21:17:04 GMT CScale has raised $145 million in funding to develop high-density interconnect infrastructure specifically designed for gigawatt-scale AI data centers. (HPCwire) https://www.eetimes.com/ai-drives-larger-denser-packaging-raising-new-challenges-for-equipment-makers Wed, 30 Sep 2026 08:55:36 GMT The increasing demand for AI computing is driving the industry toward larger and denser chip packaging, creating significant engineering challenges for equipment and material manufacturers. (EE Times) https://www.servethehome.com/nvidia-and-mediatek-ink-3-5b-investment-deal-accelerate-nvlink-fusion-adoption Tue, 01 Sep 2026 17:00:00 GMT NVIDIA and MediaTek have entered into a $3.5 billion investment agreement to accelerate the adoption of NVLink Fusion technology for high-speed GPU-to-GPU interconnects. (ServeTheHome) https://www.digitimes.com/news/a20260901VL205/profit-revenue-cxmt-dram-2026.html Tue, 01 Sep 2026 03:55:00 GMT Chinese memory chip manufacturers reported record-breaking revenue for the first half of the year, driven by significant gains in memory hardware demand. (DigiTimes) https://www.hpcwire.com/off-the-wire/chronoscale-plans-50-mw-ai-compute-deployment-with-microsoft Mon, 31 Aug 2026 19:46:08 GMT ChronoScale has announced a plan to deploy a 50 MW AI compute facility in partnership with Microsoft. (HPCwire)