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<title>Samsung Electro-Mechanics</title>
<link>https://gridtochip.site/companies/samsung-electro-mechanics</link>
<description>News and posts about Samsung Electro-Mechanics on GridToChip</description>
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<title>Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity</title>
<link>https://www.digitimes.com/news/a20261023PD226/tesla-nvidia-semco-production-abf-substrate.html</link>
<pubDate>Fri, 23 Oct 2026 03:44:29 GMT</pubDate>
<description>Tesla and Nvidia are reportedly investing combined funds into Samsung Electro-Mechanics to expand ABF substrate production capacity in South Korea. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion</title>
<link>https://www.digitimes.com/news/a20261021VL201/semco-demand-chips-semiconductors-bga.html</link>
<pubDate>Wed, 21 Oct 2026 01:23:11 GMT</pubDate>
<description>Samsung Electro-Mechanics won a large contract to supply package substrates for memory semiconductors due to rising AI demand. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics extends long-term contracts to memory substrates, totaling KRW4.3T</title>
<link>https://www.digitimes.com/news/a20261021PD206/semco-packaging-2027-2026-silicon.html</link>
<pubDate>Wed, 21 Oct 2026 00:45:00 GMT</pubDate>
<description>Samsung Electro-Mechanics signed a long-term supply agreement for memory packaging substrates, expanding its existing agreements that cover MLCCs and silicon capacitors. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints</title>
<link>https://www.digitimes.com/news/a20261016VL216/equipment-semco-expansion-production-substrate.html</link>
<pubDate>Sat, 17 Oct 2026 00:07:22 GMT</pubDate>
<description>Samsung Electro-Mechanics' planned expansion for AI server substrate production is reportedly facing equipment supply constraints and longer delivery times from machinery manufacturers. (DigiTimes)</description>
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<title>Samsung's US$9B chip expansion faces funding, supply hurdles</title>
<link>https://www.digitimes.com/news/a20261013VL215/samsung-expansion-funding-investment-testing.html</link>
<pubDate>Tue, 13 Oct 2026 06:40:00 GMT</pubDate>
<description>Samsung is facing funding and supply chain challenges regarding its $9 billion chip production expansion. (DigiTimes)</description>
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<title>Semco moves glass substrates to package-level testing</title>
<link>https://www.digitimes.com/news/a20261008VL220/semco-glass-substrate-testing-expansion.html</link>
<pubDate>Sat, 10 Oct 2026 06:27:18 GMT</pubDate>
<description>Semco is transitioning the testing of glass substrates to the package level. (DigiTimes)</description>
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<title>Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion</title>
<link>https://www.digitimes.com/news/a20261008VL214/samsung-hanmi-substrate-expansion-equipment.html</link>
<pubDate>Thu, 08 Oct 2026 04:21:55 GMT</pubDate>
<description>Hanmi Semiconductor has secured a significant order from Samsung to expand its production capacity for chip substrates, supported by a $5 billion investment. (DigiTimes)</description>
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<title>Samsung secures customer backing for US$5B substrate expansion</title>
<link>https://www.digitimes.com/news/a20261006VL215/substrate-semco-expansion-capacity-investment.html</link>
<pubDate>Tue, 06 Oct 2026 07:05:50 GMT</pubDate>
<description>Samsung has secured backing for a $5 billion expansion to increase its production capacity for high-layer package substrates. (DigiTimes)</description>
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<title>Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging</title>
<link>https://www.digitimes.com/news/a20260916VL215/qualcomm-packaging-samsung-semco-technology.html</link>
<pubDate>Wed, 16 Sep 2026 08:02:41 GMT</pubDate>
<description>Samsung Electro-Mechanics and Qualcomm are collaborating on developing an organic bridge for advanced 2.1D packaging. (DigiTimes)</description>
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<title>AI servers are eating MLCC capacity, and Chinese suppliers are taking what's left</title>
<link>https://www.digitimes.com/news/a20260914VL212/mlcc-capacity-market-semco-murata.html</link>
<pubDate>Tue, 15 Sep 2026 08:59:13 GMT</pubDate>
<description>AI server demand is increasing prices and limiting capacity for MLCCs, forcing Chinese suppliers to pivot into PC markets. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics, LG Innotek vie in AI package substrates</title>
<link>https://www.digitimes.com/news/a20260911PD229/semco-lg-innotek-2026-substrate-technology.html?chid=10</link>
<pubDate>Fri, 11 Sep 2026 08:41:32 GMT</pubDate>
<description>Samsung Electro-Mechanics and LG Innotek showcased competing advanced package substrate technologies at the KPCA Show 2026 in response to the demands of evolving AI semiconductors. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on</title>
<link>https://www.digitimes.com/news/a20260909VL229/semco-tgv-glass-substrate-manufacturing-production-tsmc.html</link>
<pubDate>Thu, 10 Sep 2026 04:14:44 GMT</pubDate>
<description>A reliability evaluation of through-glass via modules submitted to TSMC has slowed the planned rollout of glass substrates from Samsung Electro-Mechanics. (DigiTimes)</description>
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<title>Samsung, LG secure roles as key suppliers for Apple's foldable iPhone</title>
<link>https://www.digitimes.com/news/a20260909VL228/apple-foldable-iphone-lg-innotek-samsung-sdc.html</link>
<pubDate>Wed, 09 Sep 2026 09:10:11 GMT</pubDate>
<description>Apple's anticipated foldable iPhone is expected to source key components, including displays, cameras, substrates, passives, and memory, from major South Korean suppliers like Samsung Display and LG Innotek. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too</title>
<link>https://www.digitimes.com/news/a20260902PD208/semco-price-mlcc-2026-market.html</link>
<pubDate>Wed, 02 Sep 2026 23:31:04 GMT</pubDate>
<description>Samsung Electro-Mechanics plans to raise prices for MLCCs and ABF substrates due to constrained supply and high demand from the AI server market. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand</title>
<link>https://www.digitimes.com/news/a20260901VL211/semco-mlcc-sales-2027-2026.html</link>
<pubDate>Tue, 01 Sep 2026 06:45:00 GMT</pubDate>
<description>Samsung Electro-Mechanics has announced a significant supply agreement for multilayer ceramic capacitors (MLCCs) to meet the growing demand for AI server production. (DigiTimes)</description>
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<title>Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan</title>
<link>https://www.digitimes.com/news/a20260901PD206/semco-taiwan-packaging-glass-substrate-materials.html</link>
<pubDate>Tue, 01 Sep 2026 06:33:46 GMT</pubDate>
<description>Samsung Electro-Mechanics is bringing its glass substrate technology to Semicon Taiwan to showcase its capabilities in advanced packaging materials. (DigiTimes)</description>
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