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<title>MediaTek</title>
<link>https://gridtochip.site/companies/mediatek</link>
<description>News and posts about MediaTek on GridToChip</description>
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<title>MediaTek ASIC deal with ByteDance would expand data center push</title>
<link>https://www.digitimes.com/news/a20261015PD232/bytedance-mediatek-asic-chips-business.html</link>
<pubDate>Thu, 15 Oct 2026 23:56:21 GMT</pubDate>
<description>MediaTek's partnership with ByteDance is expected to boost their expansion in data center capacity. (DigiTimes)</description>
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<title>MediaTek TPU orders rise as chip capacity war intensifies</title>
<link>https://www.digitimes.com/news/a20261001PD216/mediatek-tpu-capacity-google-revenue.html</link>
<pubDate>Thu, 01 Oct 2026 03:17:24 GMT</pubDate>
<description>MediaTek is seeing an increase in orders for its TPUs as competition for chip manufacturing capacity grows. (DigiTimes)</description>
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<title>Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag</title>
<link>https://www.digitimes.com/news/a20260917PD208/google-tpu-cowos-substrate-2027.html</link>
<pubDate>Thu, 17 Sep 2026 01:58:46 GMT</pubDate>
<description>Google's future TPU project is planning to use Intel's EMIB-T packaging technology, with MediaTek confirming that the technology is mature enough for stable mass production by 2027. (DigiTimes)</description>
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<title>MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions</title>
<link>https://www.digitimes.com/news/a20260916PD220/mediatek-dimensity-cost-2026-packaging.html</link>
<pubDate>Wed, 16 Sep 2026 02:51:27 GMT</pubDate>
<description>MediaTek launched the Dimensity 9600 Pro, choosing to retain its existing HBPoP packaging over advanced WMCM technologies used by competitors due to cost considerations. (DigiTimes)</description>
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<title>Nvidia, MediaTek deepen 20-year chip ties</title>
<link>https://www.digitimes.com/news/a20260914PD229/nvidia-mediatek-market-chipset-gpu.html</link>
<pubDate>Mon, 14 Sep 2026 23:38:34 GMT</pubDate>
<description>Nvidia invested US$3.5 billion in MediaTek's bonds, expanding their partnership to cover custom AI chips, automotive, and data center needs. (DigiTimes)</description>
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<title>Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues</title>
<link>https://www.digitimes.com/news/a20260914PD210/google-tpu-google-cloud-ceo-mediatek.html</link>
<pubDate>Mon, 14 Sep 2026 02:01:16 GMT</pubDate>
<description>Google Cloud reported that its AI server investments, specifically using its in-house TPUs, have a rapid payback period of less than one year, benefiting ASIC design partners like MediaTek and Broadcom. (DigiTimes)</description>
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<title>Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout</title>
<link>https://www.digitimes.com/news/a20260914VL200/2026-dram-intel-samsung-tsmc.html</link>
<pubDate>Mon, 14 Sep 2026 00:40:44 GMT</pubDate>
<description>AI demand continues to drive semiconductor, memory, and infrastructure spending, with price hikes, tighter inventories, and advanced planning across multiple component supply chains. (DigiTimes)</description>
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<title>Realtek expands cloud AI push with ASIC and SSD chips</title>
<link>https://www.digitimes.com/news/a20260909PD224/realtek-asic-cloud-ai-chips-chairman.html</link>
<pubDate>Wed, 09 Sep 2026 07:23:00 GMT</pubDate>
<description>Realtek is expanding its AI focus by generating revenue from ASIC projects and entering 3nm product manufacturing, even though its ASIC business is currently smaller than MediaTek's. (DigiTimes)</description>
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<title>Young Liu urges 'Made with Taiwan' supply chain rethink</title>
<link>https://www.digitimes.com/news/a20260903PD203/taiwan-supply-chain-foxconn-young-liu-chairman.html</link>
<pubDate>Thu, 03 Sep 2026 23:54:09 GMT</pubDate>
<description>Foxconn's Young Liu advocated for a shift in Taiwan's industrial model from manufacturing goods to exporting technological expertise and partnership across the global supply chain. (DigiTimes)</description>
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<title>Taiwan's supply chain is 'one of a kind,' MediaTek CEO says</title>
<link>https://www.digitimes.com/news/a20260903PD224/mediatek-taiwan-ceo-taiwan-supply-chain-capacity.html</link>
<pubDate>Thu, 03 Sep 2026 02:11:44 GMT</pubDate>
<description>MediaTek's CEO stated that Taiwan's supply chain capabilities are superior for the AI and robotics era, implying a significant future need for chip capacity. (DigiTimes)</description>
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<title>AI substrate shortages widen as Unimicron signals capacity support through 2029</title>
<link>https://www.digitimes.com/news/a20260903PD222/unimicron-substrate-capacity-demand-semicon-taiwan.html</link>
<pubDate>Thu, 03 Sep 2026 01:51:39 GMT</pubDate>
<description>Unimicron confirmed it is working to alleviate the shortage of AI substrates, providing capacity support for MediaTek through 2029, at Semicon Taiwan 2026. (DigiTimes)</description>
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<title>MediaTek pushes advanced packaging and supply chain to keep pace with AI</title>
<link>https://www.digitimes.com/news/a20260902PD222/packaging-supply-chain-2026-mediatek-taiwan.html</link>
<pubDate>Wed, 02 Sep 2026 04:16:34 GMT</pubDate>
<description>MediaTek is scaling its advanced packaging capabilities and supply chain to support the growing demand for AI infrastructure. (DigiTimes)</description>
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<title>NVIDIA and Mediatek Ink $3.5B Investment Deal, Accelerate NVLink Fusion Adoption</title>
<link>https://www.servethehome.com/nvidia-and-mediatek-ink-3-5b-investment-deal-accelerate-nvlink-fusion-adoption</link>
<pubDate>Tue, 01 Sep 2026 17:00:00 GMT</pubDate>
<description>NVIDIA and MediaTek have entered into a $3.5 billion investment agreement to accelerate the adoption of NVLink Fusion technology for high-speed GPU-to-GPU interconnects. (ServeTheHome)</description>
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<title>Nvidia pours $3.5 billion into MediaTek — company will adopt NVLink Fusion for its custom AI accelerators</title>
<link>https://www.tomshardware.com/tech-industry/artificial-intelligence/nvidia-pours-usd3-5-billion-into-mediatek-company-will-adopt-nvlink-fusion-for-its-custom-ai-accelerators</link>
<pubDate>Tue, 01 Sep 2026 14:42:22 GMT</pubDate>
<description>Nvidia has invested $3.5 billion in MediaTek, which will utilize NVLink Fusion technology for its custom AI accelerator designs. (Tom's Hardware)</description>
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<title>Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption</title>
<link>https://www.digitimes.com/news/a20260901PD211/nvidia-mediatek-data-center-adoption-partnership.html</link>
<pubDate>Tue, 01 Sep 2026 00:44:03 GMT</pubDate>
<description>Nvidia and MediaTek are collaborating to promote and accelerate the adoption of custom AI chips for data center applications. (DigiTimes)</description>
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<title>Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding</title>
<link>https://www.digitimes.com/news/a20260831VL218/design-mediatek-funding-startup-eda.html</link>
<pubDate>Mon, 31 Aug 2026 08:07:17 GMT</pubDate>
<description>Agentrys, a startup using agentic tools for semiconductor design, secured $24.5 million in funding from investors including MediaTek. (DigiTimes)</description>
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<title>Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6</title>
<link>https://www.digitimes.com/news/a20260831VL200/2nm-apple-capacity-expansion-mediatek-semiconductor-industry.html</link>
<pubDate>Mon, 31 Aug 2026 01:27:24 GMT</pubDate>
<description>The week's semiconductor news covered AI chip advancements, advanced packaging strategies, and shifts in data center infrastructure investments across major players including Apple, Google, MediaTek, and Qualcomm. (DigiTimes)</description>
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