<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0">
<channel>
<title>LG Innotek</title>
<link>https://gridtochip.site/companies/lg-innotek</link>
<description>News and posts about LG Innotek on GridToChip</description>
<item>
<title>TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition</title>
<link>https://www.digitimes.com/news/a20261021PD232/lcd-acquisition-packaging-plant-demand.html</link>
<pubDate>Wed, 21 Oct 2026 03:45:00 GMT</pubDate>
<description>Due to high demand for AI infrastructure, companies are looking to convert idle LCD fabrication plants into advanced semiconductor packaging and AI computing facilities, with LG Innotek considering an acquisition from LG Display. (DigiTimes)</description>
</item>
<item>
<title>Samsung Electro-Mechanics, LG Innotek vie in AI package substrates</title>
<link>https://www.digitimes.com/news/a20260911PD229/semco-lg-innotek-2026-substrate-technology.html?chid=10</link>
<pubDate>Fri, 11 Sep 2026 08:41:32 GMT</pubDate>
<description>Samsung Electro-Mechanics and LG Innotek showcased competing advanced package substrate technologies at the KPCA Show 2026 in response to the demands of evolving AI semiconductors. (DigiTimes)</description>
</item>
<item>
<title>Samsung, LG secure roles as key suppliers for Apple's foldable iPhone</title>
<link>https://www.digitimes.com/news/a20260909VL228/apple-foldable-iphone-lg-innotek-samsung-sdc.html</link>
<pubDate>Wed, 09 Sep 2026 09:10:11 GMT</pubDate>
<description>Apple's anticipated foldable iPhone is expected to source key components, including displays, cameras, substrates, passives, and memory, from major South Korean suppliers like Samsung Display and LG Innotek. (DigiTimes)</description>
</item>
<item>
<title>LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up</title>
<link>https://www.digitimes.com/news/a20260909VL214/lg-innotek-glass-substrate-inspection-production-2028.html</link>
<pubDate>Wed, 09 Sep 2026 04:33:59 GMT</pubDate>
<description>LG Innotek is using internal AI to address microcracks in semiconductor glass substrates, aiming for initial production by around 2028. (DigiTimes)</description>
</item>
</channel>
</rss>