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<title>Foxconn (Hon Hai)</title>
<link>https://gridtochip.site/companies/foxconn</link>
<description>News and posts about Foxconn (Hon Hai) on GridToChip</description>
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<title>Taiwan raising $4 billion to build industrial park in Texas to support US chipmaking supply chain</title>
<link>https://www.tomshardware.com/tech-industry/semiconductors/taiwan-raising-usd4-billion-to-build-industrial-park-in-texas-to-support-us-chipmaking-supply-chain-project-to-support-countless-small-manufacturers-crucial-to-tsmc-foxconn-supply-chain</link>
<pubDate>Fri, 16 Oct 2026 11:57:18 GMT</pubDate>
<description>Taiwan plans to build a $4 billion industrial park in Texas to help smaller Taiwanese companies expand their presence supporting major chipmakers. (Tom's Hardware)</description>
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<title>Taisic Materials expands SiC capacity for AI data centers, 8-inch markets</title>
<link>https://www.digitimes.com/news/a20261012PD243/taisic-sic-kenmec-data-development.html</link>
<pubDate>Tue, 13 Oct 2026 08:10:00 GMT</pubDate>
<description>Taisic Materials is expanding its Silicon Carbide (SiC) production capacity to serve the power electronics and electrical equipment needs of AI data centers. (DigiTimes)</description>
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<title>Robots still can't build Nvidia's AI servers as well as people can</title>
<link>https://www.digitimes.com/news/a20261006PD223/automation-manufacturing-robot-foxconn-nvidia.html</link>
<pubDate>Wed, 07 Oct 2026 00:45:26 GMT</pubDate>
<description>The article discusses the limitations of using robotics to assemble complex Nvidia AI server hardware compared to human manual assembly. (DigiTimes)</description>
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<title>TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung</title>
<link>https://www.digitimes.com/news/a20260922PD212/packaging-tsmc-ase-kaohsiung-demand.html</link>
<pubDate>Tue, 22 Sep 2026 03:58:07 GMT</pubDate>
<description>Taiwan is establishing its first advanced packaging cluster in Kaohsiung, led by TSMC, in response to rising demand from AI and HPC. (DigiTimes)</description>
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<title>Tesla AI server order puts Pegatron back alongside Asus, 18 years after split</title>
<link>https://www.digitimes.com/news/a20260921PD205/asus-pegatron-ai-server-tesla-growth.html</link>
<pubDate>Mon, 21 Sep 2026 04:09:05 GMT</pubDate>
<description>Asus and Pegatron are collaborating on AI server designs, aiming to compete with established players like Quanta, Wistron, Foxconn, and Gigabyte. (DigiTimes)</description>
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<title>Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects</title>
<link>https://www.digitimes.com/news/a20260916PD233/fit-foxconn-subsidiary-communications-2026.html</link>
<pubDate>Thu, 17 Sep 2026 04:13:05 GMT</pubDate>
<description>Foxconn Interconnect Technology held an event themed 'Light at Scale' to discuss the next generation of AI connectivity, covering optics, photonics, and manufacturing challenges. (DigiTimes)</description>
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<title>Foxconn links FII and FIT to tackle AI infrastructure beyond the chip</title>
<link>https://www.digitimes.com/news/a20260917PD211/fii-foxconn-fit-infrastructure-chairman.html</link>
<pubDate>Thu, 17 Sep 2026 02:45:00 GMT</pubDate>
<description>Foxconn is advancing beyond just supplying chips, offering comprehensive system-level solutions that integrate AI servers, high-speed interconnects, optical communications, power, and cooling. (DigiTimes)</description>
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<title>Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030</title>
<link>https://www.digitimes.com/news/a20260916VL204/sharp-nvidia-2030-foxconn-manufacturing.html</link>
<pubDate>Wed, 16 Sep 2026 02:48:47 GMT</pubDate>
<description>Sharp Corporation began taking orders for Nvidia AI servers, manufactured by Foxconn, aiming to generate JPY250 billion in revenue by fiscal 2030. (DigiTimes)</description>
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<title>Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment</title>
<link>https://www.digitimes.com/news/a20260914PD225/data-design-fit-cpo-cooling.html</link>
<pubDate>Mon, 14 Sep 2026 04:55:00 GMT</pubDate>
<description>AI data centers are rapidly adopting 1.6T connectivity, while 800G becomes standard for AI clusters and 400G remains prevalent in general enterprise use. (DigiTimes)</description>
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<title>AI infrastructure race shifts to Grid-to-Chip as Foxconn, Delta, Flex converge on the same track</title>
<link>https://www.digitimes.com/news/a20260910PD235/flex-foxconn-infrastructure-data-center-manufacturing.html</link>
<pubDate>Mon, 14 Sep 2026 00:40:51 GMT</pubDate>
<description>Industry focus for AI infrastructure is shifting from compute components to power, thermal management, and electrical grid components, exemplified by Flex's acquisition of EPC Power. (DigiTimes)</description>
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<title>Foxconn's global expansion signals a longer-term manufacturing shift</title>
<link>https://www.digitimes.com/news/a20260910PD217/foxconn-manufacturing-taiwan-pandemic-talent.html</link>
<pubDate>Thu, 10 Sep 2026 21:52:17 GMT</pubDate>
<description>Foxconn's global expansion strategy, implemented over the last decade, is being highlighted as a way to build supply chain resilience against geopolitical shifts. (DigiTimes)</description>
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<title>Foxconn revenue climbs on AI server demand, outlook improves</title>
<link>https://www.digitimes.com/news/a20260907PD200/foxconn-electronics-revenue-demand-sales.html</link>
<pubDate>Mon, 07 Sep 2026 01:32:44 GMT</pubDate>
<description>Foxconn reported sharp revenue increases due to continued demand for AI servers and related cloud and networking hardware, suggesting the global supply chain remains supported. (DigiTimes)</description>
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<title>Young Liu urges 'Made with Taiwan' supply chain rethink</title>
<link>https://www.digitimes.com/news/a20260903PD203/taiwan-supply-chain-foxconn-young-liu-chairman.html</link>
<pubDate>Thu, 03 Sep 2026 23:54:09 GMT</pubDate>
<description>Foxconn's Young Liu advocated for a shift in Taiwan's industrial model from manufacturing goods to exporting technological expertise and partnership across the global supply chain. (DigiTimes)</description>
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<title>AI substrate shortages widen as Unimicron signals capacity support through 2029</title>
<link>https://www.digitimes.com/news/a20260903PD222/unimicron-substrate-capacity-demand-semicon-taiwan.html</link>
<pubDate>Thu, 03 Sep 2026 01:51:39 GMT</pubDate>
<description>Unimicron confirmed it is working to alleviate the shortage of AI substrates, providing capacity support for MediaTek through 2029, at Semicon Taiwan 2026. (DigiTimes)</description>
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<title>Every company inside a GB300 NVL72 rack, by exchange</title>
<link>https://gridtochip.site/blog/nvl72-companies-by-exchange</link>
<pubDate>Wed, 02 Sep 2026 00:00:00 GMT</pubDate>
<description>Walking Nvidia's flagship rack from cabinet to cold plate, and sorting the suppliers by where they trade.</description>
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<title>France draws Taiwanese investment projects worth EUR7.5 billion</title>
<link>https://www.digitimes.com/news/a20260828VL219/investment-france-taiwan-photonics-expansion.html</link>
<pubDate>Mon, 31 Aug 2026 01:26:01 GMT</pubDate>
<description>Taiwanese companies are investing approximately EUR7.5 billion into French projects, focusing on advanced semiconductor packaging and AI infrastructure. (DigiTimes)</description>
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<title>India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers</title>
<link>https://www.digitimes.com/news/a20260828VL209/design-data-manufacturing-materials-packaging.html</link>
<pubDate>Sun, 30 Aug 2026 23:25:24 GMT</pubDate>
<description>India is expanding its semiconductor and AI ambitions across chip design, manufacturing, materials, and data centers through new investments by various companies. (DigiTimes)</description>
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<title>Foxconn eyes higher margins with push beyond contract manufacturing</title>
<link>https://www.digitimes.com/news/a20260828PD212/foxconn-manufacturing-technology-adoption-data.html</link>
<pubDate>Fri, 28 Aug 2026 08:25:00 GMT</pubDate>
<description>Foxconn outlined its strategy for the generative AI era, detailing how it uses AI not only in developing internal models but also for smart manufacturing and achieving energy efficiency. (DigiTimes)</description>
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