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<title>Applied Materials</title>
<link>https://gridtochip.site/companies/applied-materials</link>
<description>News and posts about Applied Materials on GridToChip</description>
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<title>Applied Materials CEO says agentic AI drives wafer demand</title>
<link>https://www.digitimes.com/news/a20261015PD231/applied-materials-demand-wafer-ceo-equipment.html</link>
<pubDate>Thu, 15 Oct 2026 08:02:25 GMT</pubDate>
<description>Applied Materials CEO Gary Dickerson reported that AI-driven demand for higher yields and increased wafer output is expected to drive over 20% revenue growth in related businesses. (DigiTimes)</description>
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<title>Samsung, Applied Materials back startup targeting chip packaging warpage</title>
<link>https://www.digitimes.com/news/a20261015VL215/samsung-applied-materials-packaging-venture-capital-technology.html</link>
<pubDate>Thu, 15 Oct 2026 04:27:39 GMT</pubDate>
<description>Samsung Ventures and Applied Materials' venture arm invested in Flexcompute to develop simulation technology for predicting and managing deformation in advanced semiconductor packaging. (DigiTimes)</description>
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<title>AI chip complexity is widening opportunities for semiconductor equipment makers</title>
<link>https://www.digitimes.com/news/a20261015PD212/equipment-chips-performance-applied-materials-market.html</link>
<pubDate>Thu, 15 Oct 2026 02:26:49 GMT</pubDate>
<description>Increased complexity in AI chip manufacturing, specifically regarding transistor density and interconnects, is driving higher demand for advanced semiconductor equipment. (DigiTimes)</description>
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<title>Applied Materials targets US$5 billion advanced packaging revenue</title>
<link>https://www.digitimes.com/news/a20261015PD211/applied-materials-packaging-revenue-growth-equipment.html</link>
<pubDate>Thu, 15 Oct 2026 02:23:47 GMT</pubDate>
<description>Applied Materials projects over $5 billion in revenue from its advanced packaging business as AI chip demand drives the transition to multi-die designs. (DigiTimes)</description>
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<title>Applied Materials CEO says AI race hinges on technology and capacity</title>
<link>https://www.digitimes.com/news/a20261014PD226/applied-materials-ceo-technology-manufacturing-capacity.html</link>
<pubDate>Wed, 14 Oct 2026 02:47:58 GMT</pubDate>
<description>The CEO of Applied Materials stated that the AI race's success depends on both technological advancement and available capacity in the semiconductor supply chain. (DigiTimes)</description>
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<title>Qualcomm says edge AI faces power, cost, and scale hurdles</title>
<link>https://www.digitimes.com/news/a20261014PD216/qualcomm-cost-data-materials-technology.html</link>
<pubDate>Wed, 14 Oct 2026 01:35:00 GMT</pubDate>
<description>Qualcomm indicated that edge AI implementations face challenges related to power consumption, operational cost, and scalability. (DigiTimes)</description>
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<title>TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration</title>
<link>https://www.digitimes.com/news/a20261013PD240/intel-tsmc-samsung-technology-development.html</link>
<pubDate>Wed, 14 Oct 2026 01:09:01 GMT</pubDate>
<description>Major chip manufacturers are collaborating on integrating next-generation technologies to advance AI chipmaking capabilities. (DigiTimes)</description>
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<title>Applied Materials Brings Chipmakers Together at New EPIC R&amp;D Center</title>
<link>https://www.hpcwire.com/off-the-wire/applied-materials-brings-chipmakers-together-at-new-epic-rd-center</link>
<pubDate>Tue, 13 Oct 2026 23:01:22 GMT</pubDate>
<description>Applied Materials is opening a new EPIC R&amp;D center to foster collaboration between chipmakers and enhance innovation in semiconductor manufacturing equipment and materials. (HPCwire)</description>
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<title>Applied Materials opens R&amp;amp;D center to speed chipmaking for the AI era</title>
<link>https://www.digitimes.com/news/a20261013PD213/applied-materials-development-equipment-california-materials.html</link>
<pubDate>Tue, 13 Oct 2026 01:48:12 GMT</pubDate>
<description>Applied Materials is opening a new R&amp;D center to accelerate chip manufacturing capabilities for AI-driven demand. (DigiTimes)</description>
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<title>Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D</title>
<link>https://www.digitimes.com/news/a20261007PD242/applied-materials-intel-ai-chip-manufacturing-development.html</link>
<pubDate>Fri, 09 Oct 2026 01:42:39 GMT</pubDate>
<description>Applied Materials and Intel are collaborating to address AI chip bottlenecks by focusing on interconnect scaling and Foveros 3D packaging technologies. (DigiTimes)</description>
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<title>Applied Materials and Intel Collaborate on Chipmaking Innovations for AI-Driven Computing</title>
<link>https://www.hpcwire.com/off-the-wire/applied-materials-and-intel-collaborate-on-chipmaking-innovations-for-ai-driven-computing</link>
<pubDate>Wed, 07 Oct 2026 21:22:50 GMT</pubDate>
<description>Applied Materials and Intel are collaborating on manufacturing innovations to support the production of high-performance chips required for AI computing. (HPCwire)</description>
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<title>Intel and Applied Materials to collaborate on chip manufacturing advancements</title>
<link>https://www.datacenterdynamics.com/en/news/intel-and-applied-materials-to-collaborate-on-chip-manufacturing-advancements</link>
<pubDate>Wed, 07 Oct 2026 12:04:06 GMT</pubDate>
<description>Intel and Applied Materials are collaborating to develop new manufacturing technologies and equipment for advanced chip production. (Data Center Dynamics)</description>
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<title>Applied Materials, Besi broaden packaging partnership for AI chip integration</title>
<link>https://www.digitimes.com/news/a20261005VL201/applied-materials-partnership-packaging-development-manufacturing.html</link>
<pubDate>Mon, 05 Oct 2026 01:31:08 GMT</pubDate>
<description>Applied Materials and Besi are expanding their partnership to enhance packaging capabilities for AI chip integration. (DigiTimes)</description>
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<title>Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push</title>
<link>https://www.digitimes.com/news/a20260930PD252/applied-materials-kioxia-3d-packaging-2026.html</link>
<pubDate>Thu, 01 Oct 2026 01:58:24 GMT</pubDate>
<description>Applied Materials has partnered with Kioxia to expand its EPIC Center capabilities for advancing 3D stacking and AI memory technologies. (DigiTimes)</description>
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<title>Applied Materials and Kioxia team up on AI-era memory tech</title>
<link>https://www.digitimes.com/news/a20261001PR200/kioxia-applied-materials-silicon-valley-materials-efficiency.html</link>
<pubDate>Thu, 01 Oct 2026 01:13:37 GMT</pubDate>
<description>Applied Materials and Kioxia have partnered to develop advanced memory technologies to support the increasing demands of AI hardware. (DigiTimes)</description>
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<title>Singapore deepens chip R&amp;amp;D ties with Applied Materials, KLA and GlobalFoundries</title>
<link>https://www.digitimes.com/news/a20260925PD201/kla-applied-materials-globalfoundries-manufacturing-silicon.html</link>
<pubDate>Fri, 25 Sep 2026 09:15:59 GMT</pubDate>
<description>Singapore is expanding its semiconductor R&amp;D ecosystem, focusing on advanced packaging and silicon photonics with partners like Applied Materials, KLA, and GlobalFoundries. (DigiTimes)</description>
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<title>Singapore brands its chip sector as it tries to move up from manufacturing</title>
<link>https://www.digitimes.com/news/a20260925PD201/kla-applied-materials-globalfoundries-manufacturing-silicon.html</link>
<pubDate>Fri, 25 Sep 2026 09:15:59 GMT</pubDate>
<description>Singapore is strengthening its semiconductor industry by increasing R&amp;D collaboration with companies like Applied Materials, KLA, and GlobalFoundries, focusing on advanced packaging and silicon photonics. (DigiTimes)</description>
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<title>Applied Materials to invest $5bn to bolster chip ambitions in India over coming decade</title>
<link>https://www.datacenterdynamics.com/en/news/applied-materials-to-invest-5bn-to-bolster-chip-ambitions-in-india-over-coming-decade</link>
<pubDate>Fri, 18 Sep 2026 14:56:42 GMT</pubDate>
<description>Applied Materials plans to invest $5 billion in India to establish a large research park for bolstering its chip ambitions. (Data Center Dynamics)</description>
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<title>Global chipmakers answer India's pitch with equipment, materials, and R&amp;amp;D &amp;mdash; not fabs</title>
<link>https://www.digitimes.com/news/a20260918VL202/semicon-equipment-materials-2026-applied-materials.html</link>
<pubDate>Fri, 18 Sep 2026 01:14:10 GMT</pubDate>
<description>Major chip companies committed to supporting the Indian semiconductor ecosystem by investing in equipment, materials, and R&amp;D centers rather than announcing new fabs. (DigiTimes)</description>
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<title>Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026</title>
<link>https://www.digitimes.com/news/a20260917VL203/semicon-india-2026-materials-equipment-investment.html</link>
<pubDate>Thu, 17 Sep 2026 01:34:57 GMT</pubDate>
<description>Major equipment and materials suppliers announced combined investments into India's semiconductor supply chain, focusing on components and equipment rather than chip manufacturing capacity. (DigiTimes)</description>
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<title>Applied Materials announces 10-year investment plan ahead of SEMICON India</title>
<link>https://www.digitimes.com/news/a20260917VL200/applied-materials-investment-equipment-karnataka-design.html</link>
<pubDate>Thu, 17 Sep 2026 01:03:39 GMT</pubDate>
<description>Applied Materials plans a 10-year investment of US$375 million in Karnataka, India, for its operations in the Bengaluru Signature Business Park. (DigiTimes)</description>
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