{
 "id": "1.18",
 "slug": "semiconductor-test-and-burn-in",
 "url": "/parts/compute-silicon-and-packaging/semiconductor-test-and-burn-in",
 "name": "Semiconductor test & burn-in",
 "qualifiers": null,
 "layer": {
  "id": 1,
  "name": "Compute silicon & packaging"
 },
 "parent_id": null,
 "children": [],
 "summary": "The automated test equipment, probe cards, sockets, and burn-in systems used to verify a chip works before and after it's packaged.",
 "description_md": "Test and burn-in happens at multiple points in the chain — wafer-level probing before a die leaves the foundry, and package-level test and burn-in after advanced packaging is complete — using testers, probe cards, sockets, and dedicated burn-in systems from a distinct set of suppliers from the packaging and equipment side (Packaging & bonding equipment). It's the quality gate between every other step in this layer and a shippable, working accelerator, and some OSATs handling overflow packaging work (see the OSAT child part under advanced packaging) also provide test services directly.\nInvestor interest in this sub-layer tends to track how much more test time and how many more test insertions a given AI die needs relative to a conventional logic chip — larger, more complex, higher-value dies raise the cost of letting a defective unit through, which pushes toward more thorough (and more expensive) test and burn-in per unit rather than toward higher unit test cost. Supplier concentration is meaningful in testers specifically, with a more fragmented set of vendors for probe cards, sockets, and handlers.",
 "ai_delta": "Larger, more complex, and higher-value AI dies raise the cost of letting a defective unit through, pushing more test time and more test insertions onto each unit shipped.",
 "bottleneck_status": null,
 "scale_tiers": [
  "enterprise",
  "hyperscale_building",
  "ai_campus",
  "gw_class"
 ],
 "density_modes": [
  "any"
 ],
 "scale_notes": "Test and burn-in throughput scales with total die volume shipped industry-wide, not with the size of any single data center.",
 "flow": [
  "compute"
 ],
 "companies": [
  {
   "company_id": "advantest",
   "name": "Advantest",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "6857.T",
   "product_note": null,
   "note": "and Teradyne (TER) testers",
   "source_url": null
  },
  {
   "company_id": "aehr",
   "name": "Aehr",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "AEHR",
   "product_note": null,
   "note": "burn-in",
   "source_url": null
  },
  {
   "company_id": "cohu",
   "name": "Cohu",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "COHU",
   "product_note": null,
   "note": "handlers",
   "source_url": null
  },
  {
   "company_id": "formfactor",
   "name": "FormFactor",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "FORM",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "isc",
   "name": "ISC",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "095340.KS",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "kyec",
   "name": "KYEC",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "2449.TW",
   "product_note": null,
   "note": "test services",
   "source_url": null
  },
  {
   "company_id": "leeno",
   "name": "Leeno",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "058470.KS",
   "product_note": null,
   "note": "test sockets",
   "source_url": null
  },
  {
   "company_id": "mpi",
   "name": "MPI",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "6223.TWO",
   "product_note": null,
   "note": "probe cards",
   "source_url": null
  },
  {
   "company_id": "technoprobe",
   "name": "Technoprobe",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "TPRO.MI",
   "product_note": null,
   "note": null,
   "source_url": null
  }
 ]
}