{
 "id": "1.16",
 "slug": "interposers-silicon-bridges-rdl",
 "url": "/parts/compute-silicon-and-packaging/interposers-silicon-bridges-rdl",
 "name": "Interposers, silicon bridges, RDL",
 "qualifiers": null,
 "layer": {
  "id": 1,
  "name": "Compute silicon & packaging"
 },
 "parent_id": null,
 "children": [],
 "summary": "The silicon interposers, bridges, and redistribution layers that route signals between a compute die, HBM stacks, and the substrate inside an advanced package.",
 "description_md": "Interposers and bridges are the wiring layer inside an advanced package: a piece of silicon (or a smaller bridge die) that sits between the compute die and HBM stacks above it and the substrate below (2.5D/3D advanced packaging, ABF / high-layer package substrates), routing the dense set of connections a multi-die AI accelerator package needs. Some of this capacity comes from the same foundries doing the most advanced logic manufacturing, and some from separate interposer-focused suppliers, which makes this sub-category's investor exposure partly overlap with, and partly separate from, foundry exposure itself.\nThe category's importance to investors is proportional to how many discrete dies a given accelerator package combines — more chiplets and more HBM stacks per package means more interposer or bridge area needed per finished accelerator, independent of overall accelerator unit growth. It's a smaller, more technical sub-position than packaging or substrates broadly, but one where a design shift toward more disaggregated, multi-die accelerator architectures would increase demand per chip even if total chip volume held flat.",
 "ai_delta": "More die per package and more instances of 2.5D/3D packaging per accelerator generation both require more interposer or bridge area, independent of overall unit growth.",
 "bottleneck_status": null,
 "scale_tiers": [
  "enterprise",
  "hyperscale_building",
  "ai_campus",
  "gw_class"
 ],
 "density_modes": [
  "any"
 ],
 "scale_notes": "Volume follows advanced-packaging unit count industry-wide rather than the size of any one facility.",
 "flow": [
  "compute"
 ],
 "companies": [
  {
   "company_id": "intel",
   "name": "Intel",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "INTC",
   "product_note": null,
   "note": "EMIB",
   "source_url": null
  },
  {
   "company_id": "samsung-electronics",
   "name": "Samsung Electronics",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "005930.KS",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "tsmc",
   "name": "TSMC",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "2330.TW",
   "product_note": null,
   "note": "CoWoS interposers, LSI bridges",
   "source_url": null
  },
  {
   "company_id": "umc",
   "name": "UMC",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "2303.TW",
   "product_note": null,
   "note": "interposer supply",
   "source_url": null
  }
 ]
}