{
 "id": "1.12",
 "slug": "packaging-and-bonding-equipment",
 "url": "/parts/compute-silicon-and-packaging/packaging-and-bonding-equipment",
 "name": "Packaging & bonding equipment",
 "qualifiers": null,
 "layer": {
  "id": 1,
  "name": "Compute silicon & packaging"
 },
 "parent_id": null,
 "children": [],
 "summary": "The bonding, dicing, inspection, and molding equipment used to physically assemble and verify advanced chip packages.",
 "description_md": "This is the equipment layer behind advanced packaging (2.5D/3D advanced packaging): the hybrid-bonding, thermo-compression bonding, dicing and grinding, molding, and inspection and metrology tools that OSATs and foundries use to physically build and check a finished package. It doesn't touch the die design at all — it's capital equipment sold to whoever is doing the packaging work, whether that's the foundry itself or a third-party OSAT — and its order book is a forward indicator for future packaging capacity additions rather than current shipment volume.\nInvestors get a more fragmented but arguably clearer read from this sub-layer than from packaging capacity itself: equipment order backlogs are disclosed on a normal capital-equipment reporting cycle, and a given tool vendor's exposure to HBM-specific bonding equipment (as opposed to general-purpose semiconductor equipment) is usually identifiable. Qualification cycles for a new tool at a customer's line are long, which tends to lock in incumbent equipment suppliers once a packaging process is established, but a shift to a new bonding technique (such as hybrid bonding gaining share over thermo-compression) can reshuffle which equipment vendors benefit.",
 "ai_delta": "Growth in advanced packaging volume for AI accelerators flows directly through to demand for the bonding, dicing, and inspection tools used to build that packaging.",
 "bottleneck_status": null,
 "scale_tiers": [
  "enterprise",
  "hyperscale_building",
  "ai_campus",
  "gw_class"
 ],
 "density_modes": [
  "any"
 ],
 "scale_notes": "Capacity investment here tracks industry-wide advanced-packaging volume rather than any single data center build.",
 "flow": [
  "compute"
 ],
 "companies": [
  {
   "company_id": "applied-materials",
   "name": "Applied Materials",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "AMAT",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "asmpt",
   "name": "ASMPT",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "0522.HK",
   "product_note": null,
   "note": "thermo-compression bonders",
   "source_url": null
  },
  {
   "company_id": "besi",
   "name": "BESI",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "BESI.AS",
   "product_note": null,
   "note": "hybrid bonding",
   "source_url": null
  },
  {
   "company_id": "camtek",
   "name": "Camtek",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "CAMT",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "disco",
   "name": "Disco",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "6146.T",
   "product_note": null,
   "note": "dicing/grinding",
   "source_url": null
  },
  {
   "company_id": "hanmi-semiconductor",
   "name": "Hanmi Semiconductor",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "042700.KS",
   "product_note": "HBM TC bonders",
   "note": null,
   "source_url": null
  },
  {
   "company_id": "hanwha-semitech",
   "name": "Hanwha Semitech",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "subsidiary",
   "ticker": null,
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "kla",
   "name": "KLA",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "KLAC",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "lam-research",
   "name": "Lam Research",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "LRCX",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "nova",
   "name": "Nova",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "NVMI",
   "product_note": null,
   "note": "inspection and metrology",
   "source_url": null
  },
  {
   "company_id": "onto-innovation",
   "name": "Onto Innovation",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "ONTO",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "shibaura",
   "name": "Shibaura",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "6590.T",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "suss-microtec",
   "name": "SUSS MicroTec",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "SMHN.DE",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "tokyo-electron",
   "name": "Tokyo Electron",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "8035.T",
   "product_note": null,
   "note": null,
   "source_url": null
  },
  {
   "company_id": "towa",
   "name": "Towa",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "public",
   "ticker": "6315.T",
   "product_note": null,
   "note": "molding",
   "source_url": null
  },
  {
   "company_id": "ev-group",
   "name": "EV Group",
   "role": "manufacturer",
   "confidence": "inferred",
   "ownership_type": "private",
   "ticker": null,
   "product_note": null,
   "note": "wafer bonding",
   "source_url": null
  }
 ]
}